Strength prediction method of high-entropy alloys with defect structure

A high-entropy alloy strength prediction technology, applied in prediction, instrumentation, data processing applications, etc., can solve the problems that the theoretical model of high-entropy alloy microscopic defect strength has not been established, and the crystal plasticity theory has not been used in high-entropy alloys, etc., to achieve The effect of good application prospects

Active Publication Date: 2022-07-15
HUNAN UNIV
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In previous studies, the research on the influence of micro-defects in high-entropy alloys on the strength of materials mostly used experimental measurement methods, and the corresponding theoretical model for the strength of micro-defects in high-entropy alloys has not yet been established.
In addition, the theory of crystal plasticity has not yet been applied to the study of high-entropy alloys

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Strength prediction method of high-entropy alloys with defect structure
  • Strength prediction method of high-entropy alloys with defect structure
  • Strength prediction method of high-entropy alloys with defect structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] Attached to the following figure 1 A schematic diagram and a specific example of a high-entropy alloy containing dislocation loop defects considering three effects of dislocation, dislocation loop and lattice distortion are given, and its technical solution is further elaborated. The present invention is not limited to the following examples, All the design ideas utilizing the present invention fall into the protection scope of the present invention.

[0055] Dislocations are mainly caused by the processing, preparation and service of materials, and are used as a characterization of plastic deformation of materials. Considering the main defect dislocation loops generated by FeNiMnCr high-entropy alloys during service, they are the main source of material hardening; lattice distortion is high entropy. The inherent characteristics of the alloy due to the mismatch of size and modulus of the constituent elements have a strengthening effect on the mechanical properties of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
radiusaaaaaaaaaa
shear modulusaaaaaaaaaa
radiusaaaaaaaaaa
Login to view more

Abstract

The invention relates to a method for predicting the strength of a defect-containing structure high-entropy alloy. Effectively combine dislocation theory, crystal plasticity theory, and defect theory to establish relevant strength theoretical models. The influence of dislocations, dislocation loops and severe lattice distortion effects on the properties of high-entropy alloys is considered to achieve quantitative calculation of the strength of high-entropy alloys with defect structures. The yield strength obtained by the prediction method proposed in the present invention is in good agreement with the experimental results. The relevant deformation mechanism analyzed in the present invention is of great significance for studying and predicting the influence of dislocation loop defects on the strength of high-entropy alloys. Through the prediction method proposed in the present invention, the element content of the alloy is regulated, and the influence of different element content on the yield strength is studied, thereby providing theoretical guidance for the design of high-performance high-entropy alloys. In the development process of new alloys, the method effectively avoids a large number of repeated tests, shortens the research and development cycle of high-performance high-entropy alloys, saves costs, and has great engineering value.

Description

technical field [0001] The invention relates to the field of strength prediction of defect-containing structure high-entropy alloys, in particular to dislocation theory, crystal plasticity theory and defect theory. Background technique [0002] In recent years, with the needs of modern industry, high-entropy alloys have been proposed and widely studied and used. Unlike most conventional alloys, high-entropy alloys are composed of four or more elements in equimolar or near-equimolar amounts. Therefore, it has many excellent properties, such as high strength, high hardness, wear resistance, corrosion resistance, high temperature stability, etc. However, various microscopic defects will be generated during its processing and service. For example, in the process of material solidification, the uneven distribution of thermal stress gradient leads to the generation of dislocations; the material undergoes mechanical deformation (forging, rolling), and a large number of defect str...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/20G06Q10/04G06Q50/04G06F111/10G06F119/02G06F119/14
CPCG06F30/20G06Q10/04G06Q50/04G06F2119/02G06F2119/14G06F2111/10Y02P90/30
Inventor 李甲方棋洪彭静陈阳
Owner HUNAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products