Flow stabilizing and pressurizing device of evaporator

Abstract

The invention provides a flow stabilizing and pressurizing device of an evaporator. The device comprises a heat dissipation module and a shell, wherein the heat dissipation module is formed by continuously stacking and assembling a large number of heat dissipation assemblies, each heat dissipation assembly is provided with a first plate face, a second plate face and a third plate face so as to form a semi-open inner flow channel in the heat dissipation assembly, the two ends, opposite to the inner flow channel, of the heat dissipation assembly are each provided with a fourth plate face, the heat dissipation module is provided with a water inlet channel and an air outlet channel, and the heat dissipation module is arranged in the shell and an outer cover, so that the fourth plate faces can effectively block the two ends of the inner flow channel, vaporous water evaporated by heating in the inner flow channels can be effectively retained in the inner flow channels, and the internal pressure is quickly increased so as to stably and quickly discharge the vaporous water out of the air outlet channel.

Description

technical field [0001] The invention relates to a steady-flow booster device for an evaporator, which enables liquid water to undergo liquid-gas conversion inside to achieve a heat-dissipating structure, and is suitable for providing electronic components as heat-dissipating purposes. Background technique [0002] In recent years, the calorific value of electronic components has continued to increase rapidly with the improvement of semiconductor technology; how to improve the heat dissipation capacity of electronic components and maintain the normal operation of components has become a very important engineering topic. The direct air cooling technology widely used at present can no longer meet the heat dissipation requirements of many electronic components with high heat flux, and other solutions must be sought. [0003] In the existing technology, in addition to the air cooling technology, it has the effect of using the liquid and gas state conversion of water to achieve he...

AI Technical Summary

Problems solved by technology

The direct air cooling technology currently widely used can no longer meet the cooling needs of many electronic components with high heat flux, and other solutions must be sought

[0003] In the existing technology, in addition to the air cooling technology, it has the effect of using the liquid and gas state conversion of water to achieve heat dissipation. This technology provides two sets of heat spreaders and two sets of connected pipes, and one set of heat spreaders is used for evaporation. To take away the heat absorbed by the water, another set of heat spreaders is used to condense to cool down and return the output water for cooling and heat dissipation, and the pressures in the two sets of heat spreaders are different, so the water can be automatically transported back and forth into a cycle circuit, but there is a large amount of water circulation inside the heat spreader, so when the water flow path is not restricted, the internal water is prone to leakage, and the pressure cannot be properly retained inside, thus interfering with the flow of water The situation of internal circulation affects the use efficiency

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