Wafer processing system, semiconductor machine table automatic leveling device and leveling method of semiconductor machine table automatic leveling device

Abstract

The invention relates to a wafer processing system, a semiconductor machine table automatic leveling device and a leveling method of the semiconductor machine table automatic leveling device. The semiconductor machine table automatic leveling device comprises an inclination adjusting gear, a motor, a driving gear, an inclination obtaining mechanism and a controller, wherein the inclination adjusting gear is used for driving one side of the table top of a wafer conveying machine table to ascend and descend; the driving gear is arranged on a rotating shaft of the motor and is meshed with the inclination adjusting gear; the inclination obtaining mechanism is used for obtaining inclination information of the table top of the wafer conveying machine table, and is electrically connected with the controller; and the controller is electrically connected with the motor, and is used for controlling the motor to work according to the inclination information. If the table top is inclined, the controller correspondingly controls the motor to work, the driving gear on the rotating shaft of the motor correspondingly drives the inclination adjusting gear to rotate, and the inclination adjusting gear can drive one side of the table top of the wafer conveying machine table to ascend and descend when rotating, so that the table top of the wafer conveying machine table can be adjusted to be a horizontal plane in real time.

Description

technical field [0001] The invention relates to the technical field of semiconductor photolithography, in particular to a wafer processing system, an automatic leveling device for a semiconductor machine and a leveling method thereof. Background technique [0002] Wafer processing system includes glue coating and developing equipment, exposure machine and wafer transfer machine. The coating and developing equipment is used to coat the surface of the wafer before the exposure machine exposes the wafer, and cooperate with the exposure machine to complete the photolithography process. The exposure machine is used to transfer the pattern onto the wafer. The wafer transfer machine is used to receive the wafer coated by the coating and developing equipment, and transfer the wafer to the exposure machine; after the exposure machine exposes the wafer, it transfers the wafer back to the wafer transfer machine . During the long-term transmission process of the wafer transfer machin...

AI Technical Summary

Problems solved by technology

However, when adjusting the levelness of the table top of the wafer transfer machine, a lot of manual cooperation is required to disassemble and adjust the level of the table top of the wafer transfer machine, which requires high requirements for operators and the cooperation of multiple people It can only be completed, the labor cost is high, and the work efficiency is low; in addition, the disassembly process will also cause damage to parts to a certain extent, resulting in a reduction in the service life of the device

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