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Wafer processing system, semiconductor machine table automatic leveling device and leveling method

An automatic leveling and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, measuring devices, transportation and packaging, and can solve problems such as damaged parts, high requirements, and a large number of manual cooperation

Active Publication Date: 2022-05-27
CHANGXIN MEMORY TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when adjusting the levelness of the table top of the wafer transfer machine, a lot of manual cooperation is required to disassemble and adjust the level of the table top of the wafer transfer machine, which requires high requirements for operators and the cooperation of multiple people It can only be completed, the labor cost is high, and the work efficiency is low; in addition, the disassembly process will also cause damage to parts to a certain extent, resulting in a reduction in the service life of the device

Method used

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  • Wafer processing system, semiconductor machine table automatic leveling device and leveling method
  • Wafer processing system, semiconductor machine table automatic leveling device and leveling method
  • Wafer processing system, semiconductor machine table automatic leveling device and leveling method

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Embodiment Construction

[0037] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0038]In the description of the present invention, it should be understood that the terms "first" and "second" are only used for description purposes, and cannot be interpreted as indicating or implying relative importance or the number of indicated technical features. Thus, a...

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Abstract

The invention relates to a wafer processing system, an automatic leveling device for a semiconductor machine and a leveling method thereof. The automatic leveling device for a semiconductor machine includes an inclination adjustment gear, a motor, a driving gear, an inclination acquisition mechanism and a controller. The inclination adjustment gear is used to drive one side of the table top of the wafer transfer machine to move up and down. The driving gear is arranged on the rotating shaft of the motor, and the driving gear meshes with the inclination adjusting gear. The inclination acquisition mechanism is used to acquire inclination information of the table top of the wafer transfer machine, and the inclination acquisition mechanism is electrically connected with the controller. The controller is electrically connected with the motor, and the controller is used to control the motor to work according to the inclination information. If there is an inclination on the table, the controller controls the motor to work accordingly, and the driving gear on the motor shaft drives the inclination adjustment gear to rotate accordingly. When the inclination adjustment gear rotates, it can drive one side of the table of the wafer transfer machine to do the lifting action , so that the table top of the wafer transfer machine can be adjusted to a horizontal plane in real time.

Description

technical field [0001] The invention relates to the technical field of semiconductor lithography, in particular to a wafer processing system, an automatic leveling device for a semiconductor machine and a leveling method thereof. Background technique [0002] The wafer processing system includes glue coating and developing equipment, exposure machine and wafer transfer machine. The glue coating and developing equipment is used to coat the surface of the wafer before the exposure machine exposes the wafer, and cooperate with the exposure machine to complete the lithography process. The exposure machine is used to transfer the pattern to the wafer. The wafer transfer machine is used to receive the wafers coated by the coating and developing equipment, and transfer the wafers to the exposure machine; after the exposure machine exposes the wafers, it transfers the wafers back to the wafer transfer machine. . In the long-term transfer process of the wafer transfer machine, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/07B65G41/00H01L21/677
CPCB65G49/07B65G41/003H01L21/67706B65G41/00H01L21/67259H01L21/68H01L21/67739G01C9/06G01C9/32G01C2009/066G01L1/18H01L21/68764
Inventor 梁学玉
Owner CHANGXIN MEMORY TECH INC