Electronic ceramic inner hole machining anti-cracking device

Abstract

The invention discloses an electronic ceramic inner hole machining anti-cracking device. The electronic ceramic inner hole machining anti-cracking device comprises an electronic ceramic body, elastic rolling wheels, an upper cover body plate, a lower cover body plate, an elastic thin-wall connecting frame, a long limiting rod and a compression spring, wherein an inner hole is formed in the electronic ceramic body, a compression spring is arranged outside the middle of the long limiting rod, the elastic rolling wheels are arranged outside the long limiting rod and located above and below the compression spring, the elastic rolling wheels are arranged above and below the electronic ceramic body to the position close to the inner hole of the electronic ceramic body in a covering and attaching mode, the top end and the bottom end of the long limiting rod are connected to the upper cover body plate and the lower cover body plate correspondingly, containing spaces are reserved between the upper cover body plate and the elastic rolling wheels and between the lower cover body plate and the elastic rolling wheels, a plurality of elastic thin-wall connecting frames transversely penetrate through the cross sections of the elastic thin-wall connecting frames to be tightly clamped in the containing spaces in a matching mode, and at the moment, the compression spring is in a compressed state. According to the electronic ceramic inner hole machining anti-cracking device, by means of the structure, the problem that electronic ceramics are prone to cracking in the drilling operation of light and thin electronic ceramics through traditional clamp equipment is solved.

Description

technical field [0001] The invention relates to the technical field of electronic ceramic equipment, in particular to an electronic ceramic inner hole processing anti-cracking device. Background technique [0002] Electronic ceramics are widely used in the production of electronic functional components. They are essentially different from general electrical ceramics in terms of chemical composition, microstructure and electromechanical properties. These differences are formed by a series of special technical requirements put forward by the electronics industry for electronic ceramics, the most important of which are high mechanical strength, high temperature and high humidity resistance, radiation resistance, and a wide range of dielectric constants. The dielectric loss tangent is small, and the capacitance temperature coefficient can be adjusted. High dielectric strength and insulation resistance, and excellent aging performance. [0003] Electronic ceramics can be widely...

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Problems solved by technology

[0003] Electronic ceramics can be widely used in energy, household appliances, automobiles, etc., but because of its light and thin properties, it is easy to crack when drilling. In the traditional drilling process, the fixture can only cover the part of the ceramic. The vibrating force on the ceramic can only be borne through the area in contact with the fixture, which leads to the uneven distribution of the vibrating force on the ceramic as a whole, and the thin and thin ceramic is easy to crack, so the traditional fixture equipment cannot meet the drilling operation of the thin and light ceramic

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