Display substrate, manufacturing method thereof and display device

A technology for display substrates and substrate substrates, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve problems such as side defects and defects of source-drain metal patterns, and achieve the effect of solving defects.

Pending Publication Date: 2021-11-09
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present disclosure provide a display substrate, a manufacturing method thereof, and a display device, which can solve the technical problem of defects caused by side defects of the source-drain metal pattern when the electrode layer is etched

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  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0039] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are o...

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Abstract

The invention provides a display substrate, a manufacturing method thereof and a display device. The display substrate comprises an underlayment substrate, and a source-drain metal layer, a flat layer and an electrode layer which are sequentially arranged from the side close to the underlayment substrate to the side far away from the underlayment substrate. The source-drain metal layer at least comprises a first source-drain metal pattern covered by the flat layer and a second source-drain metal pattern not covered by the flat layer. The electrode layer comprises an electrode pattern and a shielding pattern, and the electrode pattern is located on the flat layer. The shielding pattern directly covers at least part of the second source-drain metal pattern and is arranged along the pattern edge of the second source-drain metal pattern. According to the display substrate, the manufacturing method thereof and the display device provided by the embodiment of the invention, the technical problem of badness caused by side surface defects of the source-drain metal pattern when the electrode layer is etched can be solved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] In related technologies, the array substrate of a display panel includes a substrate, and a source-drain metal layer and an electrode layer on the substrate, and the source-drain metal layer includes a source electrode, a drain electrode, a data line, and each Source and drain metal patterns (such as terminals and traces of the bonding circuit, and packaging substrate patterns, etc.), the electrode layer is located on the side of the source and drain metal layer away from the substrate. [0003] When making an array substrate, firstly, a source-drain metal layer is formed on the substrate. The source-drain metal layer is made by patterning a metal layer, and the metal layer is usually made of titanium (Ti)-aluminum (Al)-titanium. Stacked structure; then, an insulatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1214H01L27/124H01L27/1259
Inventor 蔡璐张瑞卿王强王旭东金文强徐国芳景国栋田刚郭强王旭徐东李春波刘乐刘静李子华
Owner BOE TECH GRP CO LTD
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