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Wide-temperature high-reliability wireless local area network module

A wireless local area network and wide temperature technology, applied in the field of communication, can solve the problems of weak information processing ability of mobile phones, difficulty in moving flexibly, low computer charges, etc., and achieve the effect of simple structure, wide working temperature range and high communication rate

Pending Publication Date: 2021-11-09
CHANGCHUN UNIV OF SCI & TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the information processing ability of the mobile phone is relatively weak and the tariff is high, and the computer tariff for accessing the Internet is low but it is not easy to move flexibly

Method used

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  • Wide-temperature high-reliability wireless local area network module
  • Wide-temperature high-reliability wireless local area network module
  • Wide-temperature high-reliability wireless local area network module

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0019] The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals.

[0020] It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0021] In order to make the content of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0022] combined with figure 1 , a wireless local area network ...

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PUM

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Abstract

The invention discloses a wide-temperature high-reliability wireless local area network module, and the module comprises a wireless local area network module and a power supply anti-interference circuit. The module is characterized in that the transmitting end of the wireless local area network module is connected with a radio frequency temperature compensation circuit, the output end of the radio frequency temperature compensation circuit is connected with a change-over switch, the change-over switch is connected with an antenna, the antenna is used for receiving signals of a wireless local area network, the output end of the change-over switch is connected into the radio frequency anti-interference circuit, and the wireless local area network module is used for receiving signals sent by the radio frequency anti-interference circuit. Compared with the prior art, the invention has the advantages of wide working temperature range, high stability, high communication rate, simple structure and the like.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a wireless local area network module with wide temperature and high reliability. Background technique [0002] From the birth of the Internet to recent years, most of the services that users access to the Internet have been monopolized by fixed networks. In the past 10 years, the entire world has gradually moved towards mobility, informationization, and globalization. People are no longer satisfied with communication in a fixed environment. The traditional way of connecting the world has been unable to meet the challenges brought by the new lifestyle. The communication network has developed from the traditional wired network to the wireless network. Since the 1990s, mobile phones and the Internet have become the information industry. [0003] Two areas of development have been most notable. Convenient mobile phones and abundant Internet resources have greatly improved peo...

Claims

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Application Information

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IPC IPC(8): H04B1/40H04B1/10H04W84/12
CPCH04B1/40H04B1/10H04W84/12
Inventor 赵爽邹昕刘颖陈磊胡永富韩承志张保贵张原野吴建福
Owner CHANGCHUN UNIV OF SCI & TECH
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