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Display module and electronic equipment

A display module and display area technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve the problems of bottlenecks in the compression of the screen frame and the inability to further compress the screen frame, and achieve the effect of increasing the screen-to-body ratio

Pending Publication Date: 2022-03-18
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, one possible implementation of increasing the screen-to-body ratio is to compress the frame of the screen body. However, since the process technology will limit the compression of the frame of the screen body, this will cause a bottleneck in the compression of the frame of the screen body. How to break through the process The frame of the screen body cannot be further compressed due to the process, which is a technical problem urgently needed to be solved by those skilled in the art

Method used

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  • Display module and electronic equipment
  • Display module and electronic equipment
  • Display module and electronic equipment

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Embodiment Construction

[0037] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0038] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The embodiment of the invention provides a display module and electronic equipment, and relates to the technical field of display. In detail, the multi-layer signal wires are led out from the first frame area and the second frame area which are different, compared with the mode that the multi-layer signal wires are led out from a single frame area (such as the first frame area or the second frame area), the wiring density of the signal wires in the frame areas can be reduced, and it is avoided that when the frame areas are narrowed, the signal wires are damaged. And wires cannot be manufactured due to the fact that the wiring space is reduced. In this way, the frame can be further compressed under the existing process condition, and the screen-to-body ratio of the display module is increased.

Description

technical field [0001] The present application relates to the field of display technology, in particular, to a display module and electronic equipment. Background technique [0002] With the continuous development and improvement of display technology, consumers have higher and higher requirements on the screen-to-body ratio of electronic devices (such as smart phones and tablet computers, etc.). Therefore, increasing the screen-to-body ratio is a hot research direction of electronic devices at present. In the prior art, one possible implementation of increasing the screen-to-body ratio is to compress the frame of the screen body. However, since the process technology will limit the compression of the frame of the screen body, this will cause a bottleneck in the compression of the frame of the screen body. How to break through the process The frame of the screen cannot be further compressed due to the process, which is a technical problem urgently needed to be solved by tho...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L27/32
CPCH01L27/124H10K59/131
Inventor 马志丽刘少伟田苗苗朱正勇
Owner YUNGU GUAN TECH CO LTD
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