Contact structure, substrate holder, electroplating apparatus, and method for supplying power to substrate
A contact plate and contact technology, which is applied to the parts of the connection device, the contact device, the current conduction device, etc., can solve the problems of insufficient sealing force, strong sealing force, and increased area.
Pending Publication Date: 2022-04-12
EBARA CORP
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- Description
- Claims
- Application Information
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Problems solved by technology
[0007] As in Patent Document 1, if an elastically deformable hollow conical portion is provided, there is a problem that it is difficult to generate a strong sealing force.
In addition, there is a problem that the area covered by the sealant on the substrate increases
The structure in which the contact and the seal are integrated as in Patent Document 2 and Patent Document 3 is not a structure for maintaining sealing force, and sufficient sealing force cannot be obtained even in this case.
Any structure in Patent Document 1 to Patent Document 3 has a problem in preventing dissolution of the seed layer
Method used
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[0036] Hereinafter, embodiments of a plating apparatus and a substrate holder used in the plating apparatus according to the present invention will be described with reference to the drawings. In the drawings, the same or similar reference signs are attached to the same or similar elements, and overlapping descriptions of the same or similar elements may be omitted in the description of the respective embodiments. In addition, the features shown in the respective embodiments can also be applied to other embodiments as long as they do not conflict with each other.
[0037] In this specification, "substrate" not only includes semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit substrates, but also includes magnetic recording media, magnetic recording sensors, mirrors, optical elements, micromechanical elements, or partially fabricated integrated circuits, Any other object to be processed. The substrate includes substrates of arbitrary shap...
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The invention provides a contact structure, a substrate holder, a plating apparatus, and a method for supplying power to a substrate. A structure for suppressing contact between a plating solution and a substrate contact is improved. The contact structure includes: a substrate contact having a first contact portion on a tip side in contact with a substrate and a second contact portion closer to a base end side than the first contact portion; a sealing member that covers the periphery of the substrate contact and has a sealing surface that is in contact with the substrate to seal the substrate contact; a first pressing portion that elastically applies a contact pressure to the substrate to the substrate contact; and a second pressing portion that is in contact with the sealing member and that applies a contact pressure to the substrate to the sealing member independently of the first pressing portion, the first contact portion being bonded to the sealing member and the second contact portion being bonded to the substrate. The second contact portion is fitted to the seal member so as to be relatively displaceable with respect to the seal member.
Description
technical field [0001] The invention relates to a contact structure for supplying power to a substrate, a substrate support, an electroplating device and a method for supplying power to a substrate. Background technique [0002] Wiring, bumps (protruding electrodes), and the like are formed on the surface of a substrate such as a semiconductor wafer or a printed circuit board. A plating method is known as a method for forming such wiring, bumps, and the like. The plating apparatus used in the plating method includes a substrate holder that holds the end surface of a circular or polygonal substrate so that the surface to be plated is exposed while sealing the end surface of the substrate. When plating a surface of a substrate in such a plating apparatus, the substrate holder holding the substrate is immersed in a plating solution. However, in recent years, along with the downsizing of circuit line widths, the seed layer for conduction formed on the surface of the substrate ...
Claims
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IPC IPC(8): C25D17/08C25D17/10C25D17/00
CPCC25D17/004C25D17/005C25D17/06H05K3/0085H05K2203/0165H05K2203/0195H05K2203/1518H05K2203/1572H05K3/188H05K2203/0723C25D17/001C25D17/007C25D17/08H01R13/521H01R4/34H01R4/36H01R12/714H01R4/44H01R13/22
Inventor 宫本松太郎
Owner EBARA CORP