Liquid cooling heat dissipation device for DIMM
A liquid-cooled heat dissipation and liquid-cooled plate technology, which can be used in instrumentation, computing, electrical and digital data processing, etc., and can solve problems such as high thermal power consumption of DIMMs
Active Publication Date: 2022-05-06
NANCHANG HUAQIN ELECTRONIC TECH CO LTD
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Problems solved by technology
Therefore, with the continuous upgrading of DIMMs, the capacity and frequency of DIMMs are getting higher and higher, and the thermal power consumption of DIMMs is also increasing.
Method used
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[0030] In order to describe the technical content and structural features of the present invention in detail, further description will be given below in conjunction with the implementation and accompanying drawings.
[0031] see Figure 9 , showing DIMM200. The DIMM 200 includes a bottom board 201 and a plurality of memory boards 202 disposed on the bottom board 201 . The memory boards 202 are arranged vertically and parallel to each other and spaced apart from each other along the left-right direction.
[0032] see Figure 1 to Figure 3 , showing the application of the liquid cooling device 100 for DIMM of the present invention on the DIMM200.
[0033] The liquid cooling device 100 for DIMM according to the first embodiment of the present invention includes a frame, several liquid cooling plates, a water inlet pipe and a water outlet pipe. The water inlet pipe and the water outlet pipe are respectively connected on opposite sides of the frame, and the liquid cooling plate...
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A DIMM liquid cooling heat dissipation device disclosed by the present invention comprises a frame, a plurality of liquid cooling plates, a water inlet pipe and a water outlet pipe, the water inlet pipe and the water outlet pipe are respectively connected to two opposite sides of the frame, the liquid cooling plates are vertically and parallelly located in the frame at intervals, one end of each liquid cooling plate is connected to the side where the water inlet pipe is located, and the other end of each liquid cooling plate is connected to the other side where the water outlet pipe is located. The water inlet pipe, the frame, the liquid cooling plate and the water outlet pipe are communicated with one another, and liquid enters from the water inlet pipe, sequentially flows to the frame, the liquid cooling plate and the frame and finally flows out from the water outlet pipe. Compared with the prior art, the liquid cooling heat dissipation device for the DIMM has the advantages that by means of the frame, the water inlet pipe, the water outlet pipe and the liquid cooling plate, low temperature is transmitted to the liquid cooling plate through liquid flowing, heat of a memory board can be driven after the low-temperature liquid cooling plate makes contact with the memory board of the DIMM, and therefore the purpose of heat dissipation of the DIMM is achieved.
Description
technical field [0001] The invention relates to the field of electronic heat dissipation equipment, in particular to a liquid cooling heat dissipation device for DIMM. Background technique [0002] The full name of DIMM is Dual-Inline-Memory-Modules, and the Chinese name is Dual Inline Memory Module. It is a new type of memory module that provides a 64-bit data channel. [0003] Most of the current server DIMMs do not have cooling devices. With the improvement of the performance of the server, the performance requirements of the DIMM are also getting higher and higher. Therefore, with the continuous upgrading of DIMMs, the capacity and frequency of DIMM bars are getting higher and higher, and the thermal power consumption of DIMMs is also increasing. [0004] With the vigorous development of liquid cooling service technology, it is also urgent to consider the development of DIMM liquid cooling technology. Therefore, a liquid cooling device for DIMM with excellent heat diss...
Claims
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Login to View More IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201Y02D10/00
Inventor 付典林边柳坤饶岚影
Owner NANCHANG HUAQIN ELECTRONIC TECH CO LTD