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Multilayer electronic component

An electronic component and coating technology, applied in the field of multilayer electronic components, can solve problems such as solder cracking

Pending Publication Date: 2022-06-28
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the external electrodes of the MLCC, the solder that joins the substrate and the external electrodes of the MLCC, etc. may expand and contract according to temperature changes, causing mechanical stress to crack the solder

Method used

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Embodiment Construction

[0017] The following detailed description is provided to assist the reader in gaining an overall understanding of the methods, devices and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be readily apparent to those of ordinary skill in the art. The order of operations described herein are examples only, and are not limited to the order set forth herein, but changes may be made that would be readily apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. Also, descriptions of functions and constructions that would be well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.

[0018] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided so that this...

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Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a body including dielectric layers and inner electrodes alternately disposed with the dielectric layers, and outer electrodes disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a Sn plating layer disposed on the electrode layer, a Ni plating layer disposed on the Sn plating layer, and a plating layer including Pd disposed on the Ni plating layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0183608 filed with the Korean Intellectual Property Office on December 24, 2020, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a multilayer electronic assembly. Background technique [0003] Multilayer ceramic capacitors (MLCCs), a type of multilayer electronic component, are mounted in various types of electronic products such as display devices (including liquid crystal displays (LCD) and plasma display panels (PDP)), computers, smartphones, A chip capacitor used to charge or discharge it on a printed circuit board of a mobile phone, etc. [0004] With the recent increase in industry interest in automotive electrical components, MLCCs are also required to have high reliability and high strength characteristics for use in automotive or infotainment systems. [0005] In particular, multila...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/008H01G4/30
CPCH01G4/008H01G4/30H01G4/012H01G4/1209H01G4/232H01G4/224
Inventor 金玟香安佳英
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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