Error-proofing method applied to chip printing

Abstract

The mistake proofing method applied to chip printing comprises the following steps: S1, printing an electrode plate; s2, punching and cutting are carried out; the first title page and the second title page are punched to form four round punching areas, the two round punching areas on the first title page are kept unchanged, one round punching area on the second title page is moved to the cutting line, one round punching area in the round punching areas is separated by the cutting line to form two semicircular punching areas, and the two semicircular punching areas are arranged on the first title page and the second title page respectively. Deleting the first electrode plate and the last electrode plate; s3, collecting the cut electrode slices into a storage box, and checking whether the electrode slices are reversed or not; s4, checking whether the electrode plates are reversed or not when the film laminating machine is fed in the laminating process; and S5, the film stacking process is completed through a manual or automatic film stacking machine, and a final qualified product is formed. According to the invention, each piece does not need to be overlooked, whether the reversely placed electrode pieces exist in the whole pile can be directly seen, and the reversely placed electrode pieces can be easily found out.

Description

technical field [0001] The invention belongs to the technical field of error prevention of MLCC sheet-type printed electrode sheets, and particularly relates to an error-proof method applied to MLCC sheet-type printed electrode sheets. Background technique [0002] The process standard is to place the printed electrode sheets in accordance with the requirements and strictly abide by the upper and lower positions and then stack them. However, in actual production, before the lamination process is carried out, it is easy to place the electrode pieces upside down by 180°, which leads to the occurrence of bad lamination processes. [0003] The reasons are as follows: [0004] ①The confirmation that the electrode is placed upside down mainly depends on the three or three-and-a-half positioning MARK dot patterns printed on the electrode. A certain layer of electrode pads is placed upside down, and after the whole stack of electrode pads is stacked together, it cannot be distingu...

AI Technical Summary

Problems solved by technology

[0005] ②The printed graphics of the electrodes are all rectangular, and there are many layouts. After rotating 180°, the appearance difference is not obvious. If the printed MARK dot graphics are ignored when placing them, it will cause the electrodes to be placed upside down and wrong.

Putting an electric diaphragm upside down in the previous process and not finding it will increase the risk of errors in subsequent engineering

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