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Method for transfering wafers and heat treating device and ring combination

A technology of heat treatment device and heat treatment chamber, which is used in transportation and packaging, conveyor objects, electrical components, etc., and can solve the problems of non-uniform expansion of wafers, mechanical stress, high temperature gradient, slippage, etc.

Inactive Publication Date: 2004-07-14
ASM INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Second, there will be temperature gradients across the wafer, which will cause non-uniform expansion of the wafer and corresponding mechanical stresses, also known as thermal stresses
However, it has been found that when loading or unloading wafers, the above-mentioned stresses still occur, and slippage occurs as a result
After all, according to the prior art, the wafer is picked up by a cold gripper for loading and unloading, which creates high local temperature gradients near the support points, causing slippage

Method used

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  • Method for transfering wafers and heat treating device and ring combination
  • Method for transfering wafers and heat treating device and ring combination
  • Method for transfering wafers and heat treating device and ring combination

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Embodiment Construction

[0035] A first embodiment of a ring according to the invention is shown in FIG. 1 , generally indicated by 1 . The ring comprises a slightly thicker outer edge 2 and a thinner inner edge 3 . Three support pins 4 are provided. The ring 2 is provided with an operating part 5 for fastening to some kind of automatic operating machine. The wafer is indicated with 6 . The outer diameter of the wafer 6 is slightly smaller than the inner diameter of the inner edge 3, so that the wafer 6 is pressed against the support pins 4 during transport. Ring 1 is used for this transmission, as shown in FIG. 2 . The figure shows the introduction of wafers 6 into a reactor 10 comprising a top 11 and a bottom 12 which are heated in some known prior art manner. During transport, the wafer is pressed against the support pins 4 .

[0036] After the wafers have entered the reactor 10, and the reactor has been closed in some way, the gas streams 13 and 14 are activated so that the wafers will leave ...

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PUM

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Abstract

A method and installation are proposed with which a wafer is surrounded by a ring in a floating wafer reactor. This ring is used to restrict the change in temperature over the wafer, especially during introduction and removal. Moreover, such a ring can be used to position the wafer in the horizontal plane during the treatment. The wafer is not in contact with the ring during the treatment. The ring can optionally be provided with heating means.

Description

technical field [0001] The present invention relates to a method of moving wafers into and out of a thermal processing chamber, and thermal processing apparatus and ring combinations. Background technique [0002] US Patent No. 5,162,047 discloses a thermal processing apparatus comprising a thermal processing chamber, a "wafer ship" / ring assembly, a loader and a conveyor. With this arrangement, a loader is used to place and remove wafers into and from the module, and a transporter is used to bring the module into and out of the thermal processing chamber. [0003] The above assembly consists of a frame incorporating a number of rings at equal intervals, the flat sides of which are placed one above the other. Each of the above-mentioned rings is provided with a recessed portion on its inner edge, the details of which are not limited, and the wafer is placed on the recessed portion by the loader. [0004] After loading many wafers, the above-mentioned assembly is moved by th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/677
CPCH01L21/67784H01L21/67109H01L21/68
Inventor 弗拉迪米尔·伊万诺维奇·库兹涅佐夫特奥多鲁斯·杰拉尔达斯·玛利亚·奥斯特里肯克里斯蒂安纳斯·杰拉尔达斯·玛利亚·里德恩斯特·亨德克·奥古斯特·格兰内曼
Owner ASM INTERNATIONAL