Method for making semiconductor device
A manufacturing method and a read-only memory technology, which are applied in the manufacturing of semiconductor/solid-state devices, semiconductor devices, electric solid-state devices, etc., can solve the problems of poor writing, small openings, and insufficient impurity injection in the channel region.
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[0027] A first embodiment of the semiconductor device manufacturing method of the present invention will be described below with reference to the drawings.
[0028] Process 1: if Figure 1A As shown, in the same manner as step 1 of the conventional manufacturing process, a pad oxide film 2 and a silicon nitride film 3 having openings are formed on a semiconductor substrate 1 .
[0029] Process 2: if Figure 1B As shown, using silicon nitride film 3 formed on semiconductor substrate 1 as a mask, semiconductor substrate 1 is oxidized by the LOCOS method to form element isolation film 4 .
[0030] Then remove the pad oxide film 2 and silicon nitride film 3, form a gate insulating film 5 with a thickness of 14nm to 17nm by thermal oxidation, form a polysilicon film with a thickness of 100nm by CVD, and form an N-type conductive film by doping phosphorus 6.
[0031] Next, a silicide film 7 of a refractory metal such as tungsten is formed to a thickness of 150 nm. The silicide f...
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