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Chip process equipment capable of mapping chips

A technology for wafer processing and equipment, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as the inability to generate reference signals for the emitter 9a and the detector 9b, and the inability to prevent dust.

Inactive Publication Date: 2006-06-14
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the mapping operation, the pneumatic cylinder has the problem of not being able to generate a reference signal indicating the actual moving distance of the emitter 9a and the detector 9b, which is used to communicate with the distance between the emitter 9a and the detector 9b. Comparing the signal generated when the notch passes through wafer 1
[0015] (3) Moreover, in the opening and closing equipment of the above-mentioned type, which is equipped with a linear motor and causes the opener 3 to be opened together with the door 6 in the horizontal direction, there is such a problem that dust cannot be prevented from being generated from the linear motor. come out

Method used

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  • Chip process equipment capable of mapping chips
  • Chip process equipment capable of mapping chips
  • Chip process equipment capable of mapping chips

Examples

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no. 1 example

[0033] Embodiment 1 will be described below with reference to the drawings.

[0034] figure 1 An overview of wafer processing equipment 50 is shown. Wafer processing equipment 50 mainly includes a load port portion 51 and a mini-environment 52 . In the small environment 52 of the wafer processing equipment 50, in order to remove dust and maintain a high degree of cleanliness, a fan (not shown) installed on the upper part of the small environment 52 generates a constant air flow from the upper part of the small environment 52 to the lower part. In this way, dust is always expelled downwards.

[0035] The load port portion 51 and the mini-environment 52 are separated by a partition 55 and a cover 58 . A stand 53 for placing the container 2 thereon is mounted on the loadport portion 51 and is movable on the loadport portion 51 towards or away from the mini-environment 52 .

[0036] The container 2 is equipped with a main body 2a, which is a box having a space for accommodatin...

Embodiment 2

[0065]Magnetic fluid seals 48a and 48b are attached at opposite ends of the through-hole in the fixed member 39 in such a position that the rod member 47 extends therethrough. Each of the magnetic fluid seal 48a and the magnetic fluid seal 48b has a structure in which a magnetic member such as a ferrite magnet is sandwiched between two annular thin plates. Also, when a magnetic fluid is inserted between the plates, this magnetic fluid is held between the plates by the magnetic force of the ferrite magnet, and the held magnetic fluid is held in a gap with respect to an object to be sealed by surface tension. As a result, the ferrofluid film is forced on the ferrofluid seal, thereby achieving a seal. In this apparatus, between the peripheral surface of the rod member 47 and the magnetic fluid seals 48a and 48b, an oil film containing a magnetic material is arranged to be formed. Thus, it is possible to prevent dust from being generated from the rod member 47 constituting the ro...

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Abstract

Wafer processing equipment on which is removably mounted a container with an opening, the equipment is equipped with a door unit and a mapping unit, the mapping unit is equipped with a transmission type sensor, the latter has a transmitter forming a notch therebetween and detectors. After the door is opened by the door unit, the emitter and the detector move toward the opening in the container and are inserted into the inside of the container with the notch between the emitter and the detector passing through the end of the wafer, thereby detecting the wafer's Existence and non-existence. Therefore, it is possible to separate the mechanical parts that generate dust adhering to the wafer and cause contamination thereof from the container.

Description

technical field [0001] The present invention relates to a wafer processing apparatus including a wafer mapping (positioning) device having a function of detecting the presence or absence of a wafer. The invention also specifically relates to a wafer processing apparatus for detecting the presence or absence of wafers on each shelf of a rack (shelf) on which wafers are placed and which racks are housed inside clean containers, To keep wafers in good condition for use during the manufacture of semiconductor products, products related to electronic components, optical disc products, etc. Background technique [0002] In recent years, in wafer processing such as semiconductor product manufacturing, which requires high cleanliness, a technique of not making the entire room related to the processing process into a high-clean environment has been adopted. In this technique, a small space kept in high cleanliness (hereinafter referred to as a small environment) is provided in each ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 五十岚宏冈部勉宫嶋俊彦
Owner TDK CORPARATION