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Moving device

A component and support unit technology, applied in the direction of transportation and packaging, conveyor objects, furnaces, etc., can solve the problems of the damage of the cassette robot arm 100, the inability to increase the height or width of the cassette C’, waste of materials, etc.

Inactive Publication Date: 2006-08-30
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the control system of the robot arm 100 is reset, an abnormal shutdown occurs, or human operation is careless, when the robot arm 100 is about to move the substrate 15 out of the cassette C', if Figure 2A As shown, the herringbone support plates 111, 121 of the mechanical arm 100 will easily hit the cassette support rods 131', 141'
Figure 2B Partially shows the collision position of the cassette strut 141 and the fishbone-shaped support plate 121, and only one of the inner side walls 14' of the cassette is shown in the figure. When the two collide with each other, because the fishbone-shaped support plate 121 is fixed and The structure is relatively sharp and hard, and the impact with the cassette support rod 141' will cause damage to the cassette C' or the mechanical arm 100, and even cause the substrate 15 to break
[0007] Similarly, when the control system stores the substrate 15 in the robot arm 100, the support plates 111, 121 of the robot arm 100 may also hit the cassette support rods 131', 141', causing the substrate 15 to be worn or broken.
[0008] In short, when the robot arm 100 on the current TFT-LCD production line accesses the glass substrate 15 from the cassette C', because the height or width of the cassette C' cannot be increased, and due to factors such as improper operation, the robot arm M is likely to collide with the glass substrate 15. Cassette support rods 131', 141' make the herringbone support plates 111, 121 of the robot arm 100 easy to be damaged, and then the substrate 15 on the robot arm 100 is broken, resulting in a lower production yield, wasting materials and delaying the production process time

Method used

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Embodiment Construction

[0030] The content of each form disclosed in the present invention will be described in detail below with specific embodiments.

[0031] see image 3 , the transport device 200 of the present invention will be described in detail. The transport device 200 includes a main body 20 , a pair of supporting units 21 , 22 , multiple flexible components 25 , multiple supporting pins 26 , multiple protective components 27 and multiple connecting components 28 . The supporting units 21 and 22 are arranged parallel to each other and connected by the main body 20 to form a whole. The handling device 200 can move back and forth inside and outside the cassette (not shown in this figure), and is mainly used to support and access an object or other similar boards for the manufacture of thin film transistor liquid crystal displays (TFT-LCDs). Taking the process as an example, the object transported by the transport device 200 is a glass substrate.

[0032] In order to solve the problem caus...

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Abstract

A trasporter for transporting an object is composed of a main body, multiple supporting units arranged on said main body for supporting said object, multiple flexible members attached to said supporting units, and multiple protecting members arranged on said flexible members for supporting and protecting said object.

Description

technical field [0001] The present invention relates to a moving device, in particular to a method for moving multiple objects placed in a cassette and using a plurality of flexible components to ensure that the moving device will not collide with the cassette during the moving process. Affects the transfer device and the transfer device of the cassette. Background technique [0002] As far as notebook computers and electronic portable products are concerned, thinness, lightness and compactness are the main demands of the current design, and usually the panel of electronic products has a glass substrate, and the thickness of the glass substrate must also become thinner and thinner, so as to reduce the size and weight of the product . Taking the manufacturing process of a thin film transistor liquid crystal display (TFT-LCD) as an example, glass substrates for panels or other plate-shaped objects are placed in a carrier cassette, and then a robotic arm is used to transport o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/06B25J9/06
Inventor 陈盈吉刘象强卢聪林
Owner AU OPTRONICS CORP