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Inductor element

A technology of inductive components and inductance, which is applied in the direction of electrical components, inductors, electric solid devices, etc., can solve the problems that inductive components cannot work effectively, high-frequency circuits are difficult, etc.

Inactive Publication Date: 2002-07-24
RICOH KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when a current flows in the inductance element formed on the semiconductor substrate, a magnetic flux will be generated in the vertical direction in the vortex pattern electrode. Since the magnetic flux causes an eddy current to be generated on the surface of the semiconductor substrate to eliminate the effective magnetic flux, there is an inductance Problems where components do not work effectively
In particular, the higher the frequency of the signal flowing through the inductance element, the more pronounced this tendency is, so it is difficult to form a high-frequency circuit including an inductance element on a semiconductor substrate

Method used

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no. 1 Embodiment approach

[0037] figure 1 A plan view showing the inductance element of the first embodiment. figure 2 express figure 1 The diagram of the upper conductor contained in the inductance element shown, image 3 express figure 1 A diagram of the shape of the underlying conductor contained in the inductor element shown.

[0038] The inductor element 100 of this embodiment includes two spiral conductors 120 and 122 formed on a semiconductor substrate. These two conductors 120 and 122 are basically the same shape, and when viewed from the surface of the semiconductor substrate 110, one conductor 120 on the upper layer and the other conductor 122 on the lower layer are basically overlapped. Each conductor 120, 122 is formed of a material such as a metal thin film (metal layer) or polysilicon, for example.

[0039] Figure 4 is a diagram showing the connection state of the above two conductors, such as Figure 4 As shown, the outer peripheral end (outer edge end) and inner peripheral end ...

no. 2 Embodiment approach

[0063] Figure 13 shows the structure of the inductance element 100A of the second embodiment, the difference lies in the Figure 4 A predetermined impedance element 200 is added to the inductance element 100 of the first embodiment shown.

[0064] That is, in the inductance element 100 of the above-mentioned first embodiment, when we look at the one conductor 120 which is an inductance conductor and the other conductor 122 which is basically overlapped and arranged, there is only one end ( figure 1 The outer peripheral end in the illustrated example) is connected to the wire 134, and the inner peripheral end is a free end (open state). In this embodiment, since the inner peripheral end of the conductor 122 is terminated by the impedance element 200 , the overall characteristics of the inductance element 100A can be improved or adjusted.

[0065] For example, when a current flows in one conductor 120 of the inductance element 100A, although an induced current is generated in...

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Abstract

An inductor element capable of functioning properly on a substrate is provided. An inductor element 100 includes two spiral conductors 120, 122 formed on the surface of a semiconductor substrate 110. The upper conductor 120 and the lower conductor 122 have substantially the same shape, and the inner end of the conductor 120 is connected electrically with the outer end of the conductor 122. The outer and inner ends of the conductor 120 are connected with lead wires 130, 132, respectively, and the lead wire 132 connected to the inner end is led between the lower conductor 122 and the semiconductor substrate 110 to the periphery of the substrate.

Description

technical field [0001] The present invention relates to inductor elements formed on various substrates such as semiconductor substrates. Background technique [0002] A semiconductor circuit in which a scroll-shaped pattern electrode is formed on a semiconductor substrate by thin film forming technology and used as an inductance element is widely known. In this way, when a current flows in the inductance element formed on the semiconductor substrate, a magnetic flux will be generated in the vertical direction in the vortex pattern electrode. Since the magnetic flux causes an eddy current to be generated on the surface of the semiconductor substrate to eliminate the effective magnetic flux, there is an inductance A problem with a component not working effectively. In particular, the higher the frequency of the signal flowing through the inductance element, the more pronounced this tendency is, so it is difficult to form a high-frequency circuit including the inductance eleme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/00H01L27/08
CPCH01F17/0013H01F2017/0046H01L27/08
Inventor 冈本明池田毅
Owner RICOH KK