Tumble-plating device

Abstract

To provide an electrode which can more uniformly and efficiently apply plating to an object for fine plating and barrel plating equipment. The electrode consists of a hard conductive bar integrally having a bending and lowering part exhibiting a downward shape continuously with a horizontal shaft part, has a juncture on the base end side of the shaft part and an electrode body on the tip side of the bending and lowering part, respectively, and is characterized in that the portions except the juncture and the electrode body are coated by insulating layers. The electrode is so mounted in a barrel inclined to a direction perpendicular to the center of the horizontal rotating shaft that the electrode body exists to face the revolving shaft at a level lower than the center of the shaft and that the shaft part exists in a non-rotatable state at both ends of the center of the revolving shaft. (C)2004,JPO.

Description

technical field [0001] The present invention relates to a barrel plating device, in particular to a barrel plating device suitable for implementing electroplating on small workpieces, for example, for the above-mentioned conductive plate on the object (workpiece) of a small ceramic substrate with a length of 0.2 to 1 mm. A barrel plating device for electroplating. Background technique [0002] As mentioned above, in the barrel plating device for electroplating small workpieces, it is important to prevent the small workpieces in operation from entering the electrode (cathode) lead wires installed at the rotating center at both ends of the drum and the through holes through which the lead wires are inserted. Clearance between (bearing part). The reason is that in the bearing part of the electrode lead wire, for the rotating drum, since the electrode lead wire is inserted non-rotatingly, if a small workpiece enters the bearing part, the insulating layer covering the lead wire ...

AI Technical Summary

Problems solved by technology

[0014] However, if the above-mentioned barrel plating device is used, the insulating layer of the lead wire is formed with low precision in the bearing portion, and the thermal expansion rate is high.

Therefore, for example, when electroplating the above-mentioned conductive sheet on a workpiece in which the conductive sheet is partially mounted on a small ceramic substrate with a length of 0.2 to 1 mm, it is difficult to place the side of the drum in consideration of the low precision of the formation of the insulating layer and the coefficient of thermal expansion. The inner diameter of the insertion hole 32b of the bushing 32a on the plate is controlled so that the above-mentioned workpiece or a part thereof does not enter the gap between the inner peripheral surface of the insertion hole 32b and the lead wire 10a, that is, the size of the gap of the bearing part.

[0015] Moreover, if the size of the insertion hole 32b of the bushing 32a cannot be properly controlled and the insertion hole 32b is relatively small, the inner peripheral surface of the insertion hole 32b and the outer peripheral surface of the lead wire 10a are strongly opposed to each other when the drum rotates. Friction, making the rotation of the drum difficult

In addition, due to the wear of the insulating layer of the lead wire 10a, the gap between the two increases, causing the disadvantage that the workpiece or a part of the workpiece enters the gap.

In addition, if the size of the insertion hole 32b cannot be appropriately controlled or if the insertion hole 32b is relatively large, the workpiece or a part of the workpiece enters the gap when the drum rotates.

[0016] If the workpiece or a part of the workpiece enters the gap between the inner peripheral surface of the insertion hole 32b and the lead wire 10a, the gap will be blocked, and the insulating layer covering the lead wire 10a will be damaged, or the rotation of the drum will not be smooth, or the drum will be removed after plating. When the workpiece is taken out, the workpiece that blocks the above-mentioned gap remains in the drum, which reduces the disadvantages of electroplating homogeneity

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