Positive type radiosensitive composition and method for forming pattern
A sensitivity and composition technology, which is applied in the field of positive radiation-sensitive compositions, can solve the problems of limited types of monomers or polymers, and achieve superior resolution and reduce waveguide loss.
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Embodiment 1
[0257] The composition B for forming an optical waveguide was applied on the surface of the silicon substrate with a spinner, dried at 80° C. for 10 minutes, and then heated at 200° C. for 1 hour to form a lower cladding layer with a thickness of 10 μm. The lower cladding layer has a refractive index of 1.4628 at a wavelength of 1550 nm.
[0258] Next, apply the composition A for forming an optical waveguide on the lower cladding layer with a spin coater, and dry it at 80°C for 3 minutes. Wavelength 365nm, Illumination 200mW / cm 2 Exposure to UV light for 5 seconds. Next, the coating film irradiated with radiation was heated at 100° C. for 2 minutes. Then, this board|substrate was immersed in the developing solution which consists of 1.8 weight% tetramethylammonium hydroxide aqueous solution (TMAH), and the exposure part was melt|dissolved. Thereafter, heating was performed at 200° C. for 1 hour to form a core portion with a thickness of 7 μm. The refractive index of light ...
Embodiment 2
[0262] The composition D for forming an optical waveguide was applied on the surface of the silicon substrate with a spinner, dried at 80° C. for 10 minutes, and then heated at 200° C. for 1 hour to form a lower cladding layer with a thickness of 10 μm. The lower cladding layer has a light refractive index of 1.5236 at a wavelength of 1550 nm.
[0263] Next, apply the composition C for forming an optical waveguide on the lower cladding layer with a spin coater, dry it at 80°C for 1 minute, and use a photomask engraved with a waveguide pattern with a width of 4 to 20 μm to pass the irradiation wavelength 365nm, illuminance 220mW / cm 2 Exposure to UV light for 5 seconds. Next, the coating film irradiated with radiation was heated at 100° C. for 2 minutes. Thereafter, this substrate was immersed in a developer composed of a 1.8% by weight tetramethylammonium hydroxide aqueous solution (TMAH) to dissolve the exposed portion. Thereafter, heating was performed at 200° C. for 1 hou...
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