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Connection pad structure of display and manufacturing method thereof

A manufacturing method and a technology for connecting pads, which are applied in static indicators, instruments, nonlinear optics, etc., can solve problems such as product scrap, insufficient contact area, and impact on product reliability.

Inactive Publication Date: 2004-09-15
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when removing the ACF residue, the wires may be scratched due to improper operation, or the wires may be scratched during subsequent tests and personnel operations
When the scratch is too large or cuts across the entire wire, as shown by the oblique line 19, the conductive particles of the anisotropic conductive film (ACF) 17 will have a problem of insufficient contact area, and then the electrical connection path (as shown by the arrow shown) cannot pass through the scratch 19 smoothly, which will affect the reliability of the product, or even cause the product to be scrapped

Method used

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  • Connection pad structure of display and manufacturing method thereof
  • Connection pad structure of display and manufacturing method thereof
  • Connection pad structure of display and manufacturing method thereof

Examples

Experimental program
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no. 1 example

[0030] see Figure 6 , which shows a top view of the connection pad structure of the first embodiment of the present invention. A plurality of scan lines 32 and data lines 34 are formed on a display substrate 30, the scan lines 32 extend along the first direction, and the data lines 34 extend along the second direction, then the intersection arrangement of the scan lines 32 and the data lines 34 can be defined in multiple ways. The pixel area 36 of the array. A pixel electrode and a switch element (for example: TFT) can be fabricated in each pixel region 36 . A connection pad 38 is formed at the terminal of each scan line 32 , and the connection pad 38 can be electrically connected to an external IC circuit board through a signal processing substrate. Similarly, a connection pad 38 is formed at the terminal of each data line 34, and the connection pad 38 can be electrically connected to an external IC circuit board through a signal processing substrate. In addition, an open...

no. 2 example

[0035] The connection pad structure and its manufacturing method of the second embodiment of the present invention are substantially the same as those described in the first embodiment, and the same descriptions are omitted here. The difference is that the opening 40 in the first embodiment is designed as a hole, while the opening 40 in the second embodiment is designed as a plurality of holes, a strip opening or a ring opening.

[0036] Please refer to FIGS. 9-11 , which show the top view of the connection pad structure according to the second embodiment of the present invention.

[0037] see Figure 9 , which shows a top view of an opening of the second embodiment of the present invention. Each connection pad structure includes at least two openings 40 , but the diameter, symmetry and arrangement of the openings 40 are not limited.

[0038] see Figure 10 , which shows a top view of another opening of the second embodiment of the present invention. Each connection pad st...

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PUM

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Abstract

The structure includes following element: a first conducting layer formed on a substrate, a protection layer formed on the substrate and covering the first conducting layer, a second conducting layer formed on the protection layer, an opening throughout the second conducting layer and the protection layer in order to expose the first conducting layer, a third conducting layer formed on the second conducting layer, and covering sidewall and bottom of the opening. The third conducting layer is connected to the second conducting layer in order to provide first connection path electrically. The third conducting layer is connected to the first conducting layer in order to provide second connection path electrically.

Description

Technical field: [0001] The present invention relates to a display technology, especially a connection pad structure of a liquid crystal display, which is used to connect to an external drive component. The opening design of the connection pad can provide an auxiliary electrical connection path to replace a damaged wire. electrical connection path. Background technique: [0002] A liquid crystal display (liquid crystal display, LCD) is currently the most widely used type of flat panel display, which has the characteristics of low power consumption, thin and light weight, and low voltage driving. Generally speaking, the display area of ​​an LCD includes a plurality of pixel areas, which are rectangular areas defined by vertically arranged scanning lines and data lines, and each pixel area is provided with a thin film transistor (thin film transistor, hereinafter referred to as TFT) and a pixel electrode, the thin film transistor is a switching device (switching device). In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/133G02F1/136
Inventor 李俊右周诗频陈慧昌
Owner AU OPTRONICS CORP