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Computer

A computer and chassis technology, applied in the computer field, can solve problems such as ineffective cooling of heating elements, component operation failure, and elevation

Inactive Publication Date: 2004-12-01
ZALMAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This problem is made worse by electrostatic forces generated by internal components, which can eventually lead to component malfunctions
[0006] Another problem with conventional computer cooling systems is inefficiency due to active cooling of heat-generating elements within the computer case
When the computer is running, the internal temperature of the computer, defined by the computer case, rises to a temperature higher than the external temperature in a short period of time, so the heat-generating components cannot be effectively cooled by using the hot air in the computer case

Method used

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Embodiment Construction

[0041] Embodiments of the present invention will be described with reference to the drawings.

[0042] exist Figure 1 to Figure 9 A computer according to a first embodiment of the present invention is shown in .

[0043] see figure 1 and Figure 9 , the computer 1 according to the present invention includes a plurality of components 10 and a case housing the components 10 . Some components generate heat when the computer 1 is running. The chassis includes a plurality of boards. In this embodiment, the chassis is in the shape of a hexahedron, and the panels include a left side panel 22 , a right side panel 24 , an upper side panel 26 , a lower side panel 27 , a front side panel 28 and a rear side panel 29 . Each plate has a thickness of about 5-7mm. Examples of heat generating elements installed in the chassis include a central processing unit (CPU) 120 , a graphics card 140 and a power supply 160 . The heat generated by the heating element is transmitted to the chassis...

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PUM

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Abstract

Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating pars and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Description

technical field [0001] The present invention relates to computers, and more particularly to computers in which heat-generating elements are cooled efficiently and noiselessly without using a cooling fan. Background technique [0002] Computers typically include multiple functional components. Representative examples of functional components that may be installed in a computer case include a motherboard, central processing unit (CPU), graphics card, sound card, power supply, hard drive, floppy drive, CD-ROM drive, DVD-ROM drive, and the like. These internal components housed inside the computer case are connected to external devices such as monitors, mice, keyboards, external memory, printers, etc. Of these internal components housed inside a computer case, the CPU, graphics card, and power supply are considered the usual heat-generating elements. When the temperature of the internal components rises due to the heat generated by these heat generating elements, the internal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20H05K7/20
CPCG06F1/184G06F1/188H05K7/20409G06F2200/201G06F1/181G06F1/187G06F1/20G06F1/183
Inventor 李祥哲
Owner ZALMAN TECH CO LTD