Ball-planting device for making several tin balls stick to chip

Abstract

The device includes porous plate and a localizer. There are multiple holes for allocating beads, and each bead is utilized for accommodating a tin ball. The localizer is utilized for fixing the chip under the porous plate. The chip coated by a layer of adhesion agent adheres tin balls in each hole.

Description

technical field [0001] The invention provides a ball planting device, especially a ball planting device for adhering a plurality of solder balls to a chip. Background technique [0002] In recent years, with the rapid development of electronic technology and the emergence of LSI, VLSI, and ULSI, the density of a single silicon chip has been continuously increased. Due to the sharp increase in the number of I / O pins, the power consumed by each silicon chip has also increased. Therefore, the previous dual-line package (Dualin-line Package, DIP), and even the quad flat package (Quad Flat) Package, QFP) can no longer meet the actual needs, but the appearance of Ball Grid Array Package (BGA Package) fills this gap in time. [0003] Please refer to figure 1 , figure 1 It is a schematic cross-sectional view of a conventional ball grid array package 10. The ball grid array package 10 includes a substrate 12, and the substrate 12 includes a copper trace layer (Cu trace layer) 16 d...

AI Technical Summary

Problems solved by technology

Generally speaking, it takes an average of 10 to 15 minutes for a skilled maintenance personnel to spread the solder balls on all the solder pads on the surface of the ball grid array package. Staring at the BGA package for a long time will cause eye fatigue for maintenance personnel, so that it cannot be guaranteed that each solder ball implanted back into the BGA package can be accurately implanted on the corresponding soldering pad

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