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Thermally conductive body and method of manufacturing the same

A thermal conductor and thermal conductivity technology, applied in the field of thermal conductors and their preparation, can solve the problem that thermal conductors cannot obtain high enough thermal conductivity

Inactive Publication Date: 2005-05-18
POLYMATECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Accordingly, the final thermal conductor will not be able to obtain a sufficiently high thermal conductivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] In the method for producing a thermal conductor according to the present embodiment, the thermally conductive fibers can be oriented in a predetermined direction by applying magnetic force to the thermally conductive composition. Utilizing the diamagnetic properties of thermally conductive fibers, this preparation method can make thermally conductive fibers highly oriented.

[0041] It should be apparent to those skilled in the art that the present invention may be embodied in various other specific forms without departing from the scope or spirit of the invention. Especially, it should be understood that the present invention may be embodied in the following forms.

[0042] Thermally conductive fibers and non-fibrous thermally conductive fillers can be treated with a variety of surface treatments. For example, when thermally conductive fibers and / or non-fibrous thermally conductive fillers are surface-treated with coupling agents such as silane coupling agents or tita...

Embodiment 1

[0047] Addition-reactive polyorganosiloxane (liquid silicone, viscosity [25°C]: 400 mPa·s, specific gravity: 1.0, WACKERASAHIKASEI SILICONE Co., Ltd.) was used as a polymer base material, and carbon fibers (average fiber diameter : 10μm, the average fiber length: 110μm, the percentage of the number of microfibers with a length ≤ 25μm: 9.3%) and spherical alumina (average particle size: 3.2μm) as a non-fibrous thermally conductive filler, the blending ratio is shown in the table 1. This mixture was stirred until substantially homogeneous. The mixture was then defoamed to prepare a thermally conductive composition. Next, this thermally conductive composition is shaped into a sheet. Then, the formed heat-conducting composition is placed under a magnetic field of 8 tesla for 10 minutes under a magnetic field formed by a superconducting magnet. parallel to the thickness direction. Then, the thermally conductive composition was heated at 120° C. for 30 minutes to obtain a therma...

Embodiment 2

[0049] Except using different carbon fibers (average fiber diameter: 10 μm, average fiber length: 83 μm, the number percentage of microfibers with a length≤25 μm: 20.0%) as the heat-conducting fiber, use the same composition and preparation method as in Example 1 , to prepare a thermally conductive sheet (thickness: 0.5mm). When this thermally conductive sheet was observed under a microscope, it was found that carbon fibers were oriented in the thickness direction of the sheet.

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Abstract

The invention provides a heat conductor prepared by a heat conduction composition, and the heat conduction composition includes a polymer substrate, heat conduction fibers and non-fibrous heat conduction fillers. The average fiber length of the heat-conducting fibers is between 70 and 130 μm, and the heat-conducting fibers contain no more than 20% of the total amount of heat-conducting fibers with a length of 20 μm or less. The thermally conductive fibers are further diamagnetic. In a thermal conductor, the thermally conductive fibers are directionally oriented. The invention also provides a method for preparing the thermal conductor.

Description

technical field [0001] The present invention relates to thermal conductors and methods for their preparation. This thermal conductor is placed inside the electronic device between the electronic component and the cooling element, such as a heat sink or a metal heat conducting plate, and conducts the heat generated by the electronic component. Background technique [0002] In recent years, as the performance of electronic components represented by computer CPUs has become higher and higher, the energy consumption of electronic components has also increased, and at the same time, the heat generated by electronic components has also increased. Since heat can degrade the processability of electronic components, it is necessary to prevent the accumulation of heat on electronic components. Therefore, in order to maintain the performance of electronic components, cooling of electronic components becomes very important. [0003] Therefore, it is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/00B29C39/18B29C39/42B29K105/10C08J5/06C08K3/00C08K7/06C08L101/00
CPCC08K7/06C08K3/013C08L83/04C08J5/00C08J5/06
Inventor 石原奈津子
Owner POLYMATECH CO LTD