Printed circuit board inspection device and printed circuit board assembly inspection line system

Abstract

A printed circuit board inspection device is disclosed that is configured to measure the shape of a pasted solder and the shape of parts after mounting the parts in an inspection of a solder paste ona printed circuit board. This printed circuit board inspection device for a printed circuit board on which a solder paste is printed and at least one part is mounted on the solder paste, includes an inspecting section. The inspecting section calculates an amount of the solder paste not covered by an electrode of the part mounted on the solder paste based on image data captured by an imaging device, the image data showing the part mounted on the solder paste. If the calculated amount of not-covered solder paste is greater than a predetermined upper limit or smaller than a predetermined lower limit, the inspecting section determines that the solder paste is incorrectly printed.

Description

technical field [0001] The present invention relates to a technique for checking whether mounted components are correctly soldered on a printed circuit board, and more particularly to an inspection technique for accurately predicting soldering defects before soldering components in a reflow oven. Background technique [0002] In printed circuit board assemblies, visual inspection has been performed by human eyes or visual inspection devices instead of human eyes to see whether mounted components are properly soldered. [0003] For example, Japanese Patent Laid-Open Publication No. 10-311807 (hereinafter referred to as reference document 1) discloses a technique for calculating The reference state of the deformed solder, and the soldering quality is checked with reference to the reference state by an inspection device using X-rays. Japanese Patent Laid-Open Publication No. 10-170455 (hereinafter referred to as reference document 2) discloses a technique for detecting the sha...

AI Technical Summary

Problems solved by technology

[0009] When faced with future challenges such as component size reduction, use of area array components, and improvement in mounting density, conventional inspection by visual inspection devices or human eyes after soldering cannot guarantee inspection quality

[0010] In the case of using the methods of X-rays disclosed in Reference Documents 1 and 2, it is possible to inspect the welding state of an area array element that cannot be checked by visual inspection by irradiating X-rays. However, the method has a disadvantage in that X-rays The setup is expensive, the number of X-ray operators is limited, and defects are difficult to repair even when they are detected.

However, the soldering status on the area where components are mounted cannot be checked, therefore, the soldering status of high-density mounted chip components cannot be checked

[0013] The problem with the above techniques is that the printed state of solder paste and the mounted state of components cannot be checked efficiently at low cost

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