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Grindstone tool

A grinding stone and tool technology, applied in the manufacture of tools, grinders, abrasives, etc., can solve troubles and other problems

Inactive Publication Date: 2006-01-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is very troublesome to store the use records of each grinding stone, and it is difficult to guarantee that the above information has been recorded

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Preferred embodiments of the present invention will be described in detail hereinafter with reference to the accompanying drawings.

[0021] figure 1 A grinding wheel with a grindstone is shown as a grindstone tool according to the first embodiment of the present invention.

[0022] figure 1 The shown grinding wheel 2 is composed of an annular grindstone base 21 and a plurality of grindstones 22 mounted on the bottom surface of the grindstone base 21 . Each grindstone is composed of a resin grindstone manufactured by kneading abrasive grains with a resin bonding material, molding the kneaded product into a rectangular parallelepiped form, and firing it hard. One of all the grinding stones 22 made of resin grinding stones has a recessed portion 221 on the top end face as an unused area, as figure 2 As shown, the radio frequency IC tag 3 is embedded in the concave portion 221 . The radio frequency IC tag 3 includes a memory, and information can be read from or writte...

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PUM

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Abstract

A grindstone tool performs predetermined processing on a workpiece, wherein a radio IC tag from and to, which information can be read, and written, without contact is embedded in the grindstone tool.

Description

technical field [0001] The present invention relates to a grindstone tool having a grindstone such as a resin grindstone by kneading abrasive grains with a bonding material and molding the kneaded product into a predetermined form and used for predetermined processing of a workpiece and make it hard. Background technique [0002] In the production process of semiconductor devices, a plurality of regions are partitioned by dividing lines called "chip spaces" provided in a grid pattern on the front surface of a generally disk-shaped semiconductor wafer, and circuits such as ICs or LSIs are formed in each partition in the area. After the backside of the semiconductor wafer is ground to a predetermined thickness by a grinder, the semiconductor wafer is cut along a boundary line to be divided into individual semiconductor chips. [0003] The grinding wheel is used to grind the back side of the above-mentioned semiconductor wafer, and the grinding stone blade is also used to cut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00G06K19/00B24D3/28B24D99/00
CPCH01Q1/22H01Q1/2225B24D7/06B24B7/228G06K19/04
Inventor 关家一马
Owner DISCO CORP