Device and method for checking printed circuit board power source isolation

Abstract

The inspection department consists of the following: a power network extraction mechanism, which refers to the circuit design data of the printed circuit board to extract the power supply network distinguished by the power supply separation component and has power supply attributes; the part number extraction mechanism, which is used to extract the part number of the semiconductor integrated circuit connected to the extracted power supply network; the part number calculation mechanism, which is used to calculate the number of parts that have been extracted; the judgment mechanism, which is used to compare the number of calculated parts and the specified reference value; the display mechanism, which is greater than the reference value in the case of the number of components, The name of the power supply network and the part number of the semiconductor integrated circuit are displayed as the power separation is not implemented. According to this composition, it is possible to check in a short period of time whether the power supply used in the semiconductor integrated circuit room, the connector room, and the semiconductor integrated circuit between a connector is separated according to the high frequency of the power supply separation element.

Description

technical field [0001] The present invention relates to an EMC (Electro-Magnetic Compatibility) design of a printed circuit board, in particular to a power separation inspection of a printed circuit board for checking whether a power line connected to a semiconductor integrated circuit or a connecting component is subjected to high-frequency separation according to a power separation element Devices and methods. Background technique [0002] In a printed circuit board equipped with a high-speed semiconductor integrated circuit, a through current generated at a power supply terminal when the semiconductor integrated circuit is turned on becomes one of the main causes of radiated noise or conducted noise. This is because the generated through current flows through the power supply wiring to form a relatively long loop, which generates radiation noise and becomes an excitation source of resonance between the power supply plane and the ground plane. In addition, when there are ...

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Problems solved by technology

[0008] Therefore, time is required for inspection, and inspection omissions are likely to occur, and the inspection omissions at the time of completion of the printed circuit board become the main cause of the above-mentioned problems.

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