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Electronic part taping packaging cover tape

A technology for electronic components and tape packaging, which is applied in the direction of packaging, wrapping paper, electrical components, etc., can solve the problems of undisclosed heat sealability, poor peak-to-valley conductivity, transparent cover tape, and reduced installation machine efficiency , to achieve stable heat-sealing operation and good heat-sealing effect

Active Publication Date: 2006-05-24
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0037] However, due to the miniaturization of electronic components and the increase in speed of mounting machines in recent years, even if the peak-to-valley difference is slightly worse, electronic components will fly out and reduce the efficiency of mounting machines.
That is, there is no disclosure of a cover tape that satisfies all the functions of heat-sealability, peak-to-valley difference, electrical conductivity, and transparency.

Method used

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  • Electronic part taping packaging cover tape
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  • Electronic part taping packaging cover tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0163] An F-type Tetoron film (manufactured by Teijin Corporation, trade name: polyethylene terephthalate) with a thickness of 16 μm was used as the base film 11 . An anchor coating agent composed of 5 parts by mass of tetraisobutyl titanate and 95 parts by mass of n-hexane was applied to the substrate film 11 by a roll coating method, and dried so that the thickness after drying was 0.01 μm. Then, as the soft material layer 15, it can be prepared as follows, using an extruder to heat and melt the metallocene LLDPE (density 0.892), stretching it while expanding it in the required transverse direction with a T die, and extruding it into a curtain shape with a thickness of 35 μm . Then, three layers of the base film 11 / anchoring coating agent layer / soft material layer 15 were bonded and laminated by pinching between a rubber roll and a cooled metal roll. Next, corona treatment is performed on the surface of the soft material layer 15 by using a known corona treatment machine, ...

Embodiment 2～10

[0166] As the metallocene LLDPE (abbreviated as LL in the table) used for the flexible material layer 15, except that it has the properties described in Tables 1 to 2, it was performed in the same manner as in Example 1 to obtain the covers of Examples 2 to 10. bring.

[0167] project

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Abstract

The present invention relates to a cover tape for electronic component tape packaging which heat-seals a carrier tape for accommodating electronic components. The cover tape for electronic component tape packaging of the present invention includes a base film layer, a flexible material layer, and a thermal adhesive layer. The soft material layer is made of metallocene linear low-density polyethylene, and the metallocene linear low-density polyethylene has a specific gravity of 0.888 to 0.907.

Description

technical field [0001] The present invention relates to a cover tape for tape packaging, and more particularly, to a cover tape which heat-seals a carrier tape to be formed by connecting accommodating portions for accommodating electronic components. Background technique Background technique [0002] In recent years, chip-type electronic components such as IC chips and capacitors are provided for surface mounting on a circuit board or the like in a state of being tape-packed in a carrier tape. On the carrier tape, continuous embossing is formed with recesses for accommodating electronic components. After the electronic components are accommodated in the recesses, the cover tape heat-seals the corresponding recesses to form a tape package. [0003] At the time of mounting, the cover tape with the package is peeled off, and the electronic components are automatically taken out and surface-mounted on the circuit board. The cover tape must therefore be easily peelable from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D65/40B32B27/32B65D73/02C09J7/29
CPCB65D73/02C09J2423/006C09J7/29Y10T428/2817Y10T428/2848Y10T428/31938C09J2301/162H05K13/02
Inventor 藤井和仁加藤慎一
Owner DAI NIPPON PRINTING CO LTD