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RFID tag and RFID tag manufacturing method

An RFID tag, the technology behind it, which is applied in the field of RFID tags, can solve problems such as IC chip breakage or peeling, IC chip stress, and reduced reliability, and achieve the effects of reducing bending stress, avoiding fracture, and improving reliability

Inactive Publication Date: 2007-05-02
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] If the IC chip is firmly protected with a reinforcing body or a reinforcing plate as in the case of the conventional technology, although the bending stress can be reduced, due to the difference in thermal expansion (or contraction) between the IC chip and the hard reinforcing body or reinforcing plate, RFID Temperature changes in the working environment of the label will cause stress on the IC chip
This can lead to cracking or peeling of the IC chip, and there is a problem that the reliability is lowered under the condition of temperature change

Method used

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  • RFID tag and RFID tag manufacturing method
  • RFID tag and RFID tag manufacturing method
  • RFID tag and RFID tag manufacturing method

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Embodiment Construction

[0045] Embodiments of the present invention will be described below with reference to the drawings.

[0046] Fig. 2 is a side view of an RFID tag according to a first embodiment of the present invention.

[0047] The RFID tag 100 shown in FIG. 2 includes: a sheet-shaped substrate 113 made of a PET film; an antenna 112 made of a thin copper film and mounted on the substrate 113; an IC chip 111 mainly made of Si and The bump (metal protrusion) 114 is connected to the antenna 112; the adhesive 115 is mainly made of thermosetting epoxy resin and sticks the IC chip 111 to the substrate 113; and the reinforcing body 116 is made of polyphenylene sulfide and fixed to the substrate 113 and cover the entire IC chip 111 and part of the antenna 112 .

[0048] In addition to polyphenylene sulfide, materials that can be used for the reinforcement 116 include other plastic resins having the same hardness as PPS, such as ABS (acrylonitrile-butadiene-styrene copolymer), polycarbonate, ceramic...

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Abstract

The present invention provides an RFID (Radio_Frequency_IDentification) tag which exchanges information with external equipment on a non-contact basis and which can both reduce the bending stress and improve reliability under temperature changes. The RFID has a base; an antenna pattern which, being installed on the base, forms a communications antenna; a circuit chip which, being electrically connected to the antenna pattern and fixed to the base, conducts wireless communications via the antenna; and a first reinforcement body which covers the circuit chip, being fixed to the base at a location away from the circuit chip without being fixed to the circuit chip.

Description

technical field [0001] The present invention relates to an RFID (Radio Frequency Identification) tag for exchanging information with an external device in a non-contact manner and a manufacturing method thereof. Incidentally, the "RFID tag" referred to here is the "embedder of the RFID tag" known to those skilled in the art, and means a component put into the RFID tag. Also, the RFID tag is sometimes called "wireless IC tag". In addition, these RFID tags include non-contact type IC cards. Background technique [0002] In recent years, various RFID tags have been proposed that exchange information wirelessly with external devices represented by a reader / writer in a non-contact manner. As one type of RFID tag, a structure in which an antenna pattern and an integrated circuit (IC) chip for wireless communication are mounted on a substrate made of plastic or paper has been proposed. One possible application of this type of RFID tag is to attach the RFID tag to goods and ident...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07749H01L2224/75252G06K19/07728H01L2924/01057H01L2224/16G06K19/0773B03C3/30B03C3/34
Inventor 马场俊二
Owner FUJITSU LTD