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Method of manufacturing printed circuit board having landless via hole

一种印刷电路板、导通孔的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决制造工艺复杂、增加成本和处理时间周期等问题

Inactive Publication Date: 2007-06-20
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since a series of exposure and development processes need to be repeated in the process of forming the conductive layer in the blind hole and forming the circuit pattern on the surface of the base substrate, the manufacturing process is complicated, thereby increasing the cost and the processing time period.

Method used

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  • Method of manufacturing printed circuit board having landless via hole
  • Method of manufacturing printed circuit board having landless via hole
  • Method of manufacturing printed circuit board having landless via hole

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Embodiment Construction

[0033] Hereinafter, a detailed description of the present invention will be given with reference to the accompanying drawings.

[0034] 3 is a flowchart showing a process of manufacturing a PCB according to a first embodiment of the present invention, and FIGS. 4A to 4H are detailed views showing the manufacturing process step by step. Next, a method of manufacturing a PCB according to a first embodiment of the present invention will be described with reference to the above drawings.

[0035] As shown in FIG. 4A, a base substrate 110 is provided (S110), wherein the base substrate 110 is composed of a copper clad laminate (CCL) including an insulating layer 120 and copper foil 130 on both surfaces of the insulating layer, and is formed on the substrate. Through holes 112 are formed in predetermined positions.

[0036] As shown in FIG. 4B , a circuit pattern 132 having a via hole 112 is formed by etching a portion of the copper foil 130 . In this case, since the copper foil 13...

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Abstract

The invention discloses a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless via hole without the upper land of a via hole using a photoresist (P-LPR) which is loaded in the via hole. Therefore, in this invention, since a circuit pattern is formed using only copper of a copper clad laminate, the width thereof is minimized, thus easily realizing a fine circuit pattern. Further, the landless via hole structure is applied, resulting in a highly dense circuit pattern.

Description

[0001] Related Application Cross Reference [0002] This application claims priority to Korean Patent Application No. 10-2005-0123206, filed on Dec. 14, 2005, entitled "Method of Manufacturing Printed Circuit Board with Landless Via Holes", the entire contents of which are incorporated herein Reference. technical field [0003] The present invention relates to a method of manufacturing a printed circuit board (PCB) with a via hole without a land, in particular, to a method of manufacturing a printed circuit board (PCB) with a via A method of connecting a printed circuit board to a land via hole (ie, an upper land without a via hole). Background technique [0004] As the electronics industry develops, there is an increasing need to increase the functionality and reduce the size of electronic components. To meet this demand, PCBs also require high-density circuit patterns, so various methods for realizing precise circuit patterns have been devised and applied. [0005] Amon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K1/11H05K3/46H05K3/06
CPCH05K2201/0959Y10T29/49156H05K3/0094H05K3/428H05K2203/0361H05K2201/09509H05K2203/0384Y10T29/49133Y10T29/49117Y10T29/49128Y10T29/49165H05K3/421Y10T29/49155H05K2203/0542H05K2201/09545Y10T29/49126H05K1/116H05K3/40
Inventor 姜明杉冈部修一朴定现郑会枸金智恩
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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