High-frequency module
a high-frequency module and module technology, applied in the field of high-frequency modules, can solve the problems of warping of the substrate, difficult mounting of the high-frequency module on the circuit substrate, etc., and achieve the effect of reducing or preventing the influence of mounting
Active Publication Date: 2021-11-23
MURATA MFG CO LTD
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AI Technical Summary
Benefits of technology
The present invention provides high-frequency modules that can be mounted on a circuit substrate even if the substrate is warped. This is achieved by reducing or preventing the mounting from being affected by the warcpne. Even when the front surface of the substrate is covered with a sealing resin, the modules can still be mounted effectively.
Problems solved by technology
However, in a case in which the substrate is covered with the sealing resin, the substrate may be warped due to a thermal history of the high-frequency module affected by a difference between a coefficient of linear expansion of the substrate and a coefficient of linear expansion of the sealing resin.
In this case, since the rear surface of the substrate is warped, it becomes difficult to mount the high-frequency module on a circuit substrate.
Method used
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[0019]Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0020]A high-frequency module according to a first preferred embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a first side sectional view illustrating a configuration of the high-frequency module according to the first preferred embodiment of the present invention. FIG. 1 illustrates a cross section taken along a line A-A illustrated in FIG. 3. FIG. 2 is a second side sectional view illustrating the configuration of the high-frequency module according to the first preferred embodiment of the present invention. FIG. 2 illustrates a cross section taken along a line B-B illustrated in FIG. 3. FIG. 3 is a plan view illustrating the configuration of the high-frequency module according to the first preferred embodiment of the present invention. Note that FIG. 3 is a view of the mounting substrate as v...
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Abstract
A high-frequency module includes a mounting substrate, electronic components, a sealing resin, and land conductors. The mounting substrate includes a front surface, a rear surface, and a side surface. The land conductors are provided on the rear surface. The electronic components are mounted on the front surface of the mounting substrate. A distance between the mounting surface of the land conductor near the side surface and the rear surface of the mounting substrate is larger than a distance between the mounting surface of the land conductor closer to the center than the land conductor near the side surface and the rear surface of the mounting substrate.
Description
CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Japanese Patent Application No. 2018-119425 filed on Jun. 25, 2018. The entire contents of this application are hereby incorporated herein by reference.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to a high-frequency module including a mounting substrate on a front surface of which a high frequency electronic component is mounted and on a rear surface of which a land conductor is provided, and an insulating resin covering the front surface of the mounting substrate.2. Description of the Related Art[0003]Recently, various techniques have been proposed to form a single packaged module by using a plurality of electronic components to achieve a predetermined function.[0004]For example, Japanese Unexamined Patent Application Publication No. 2003-124701 describes a high-frequency module in which an electronic component is mounted on a front surface of ...
Claims
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IPC IPC(8): H01L25/00H01L25/18
CPCH01L25/18H01L23/3121H01L23/488H01L2924/181H01L2224/40225H01L23/66H01L25/16H01L2924/15313H01L2924/3511H01L2224/16227H01L2924/14215H01L23/49811H01L23/5386H01L2924/00012H01L23/31H01L24/06H01L23/367H01L25/0652
Inventor UEJIMA, TAKANORI
Owner MURATA MFG CO LTD