Resin compositions and use of the same
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- MITSUI CHEM INC
- Publication Date
- 2001-08-16
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
[0001] The present invention relates to a polyethylene resin composition excellent in moldability and capable of providing moldings having excellent pliability.
[0002] The present invention relates to a soft resin composition containing a polyethylene resin, which is capable of providing moldings excellent, particularly, in pliability and heat resistance and has an excellent moldability.
[0003] The present invention also relates to an ethylene / .alpha.-olefin copolymer composition suitable for use mainly in packaging films. More particularly, the present invention relates to an ethylene / .alpha.-olefin copolymer composition which is, as compared with the conventional ethylene copolymer compositions, excellent in film-moldability and capable of high-speed molding, and also capable of providing a film excellent in machanical strength properties, low temperature heat-sealing properties and heat-sealing stability, and further in slip characteristics and anti-blocking properties thereby bein...