Substrate treating apparatus and method

Inactive Publication Date: 2006-08-24
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008] This invention has been made having regard to the state of the art noted above, and its object is to provide a substrate treating apparatus and method for obtaining an actual specific gravity of a treating solution as an absolute value by setting a reference, and for reducing man-hours for adjustment work.
[0014] Because of the construction of the treating tank, the reference liquid simply filling the tank may have its surface level lowering with time. It is therefore desirable to circulate the reference liquid and treating solution through the circulating system. In this way, the surface level may be maintained constant to maintain the detecting end of the supply pipe at a constant depth. Thus, the same condition is provided for detecting the pressures of the reference liquid and treating solution. By equalizing the conditions for detecting the two pressures, the actual specific gravity is measured with increased accuracy.
[0016] The reference liquid at the reference temperature is stored in the treating tank in advance of treatment. The voltage obtained by the converting device in this state is stored as a reference voltage. Next, the treating solution stored in the treating tank is heated to the treating temperature by the heating device. The voltage obtained by the converting device in the state is regarded as a treatment voltage. An actual specific gravity of the treating solution is derived from the treatment voltage and the reference voltage stored beforehand. The treating solution is adjusted based on this actual specific gravity. The actual specific gravity expresses a ratio to the reference voltage of this apparatus, and has an absolute meaning. The actual specific gravity can be used for comparison between different apparatus, and can represent an absolute value readily understood by the user. A reference common to different apparatus enables a reduction in man-hours for adjusting the respective apparatus.

Problems solved by technology

This pressure cannot be used for comparison with other apparatus of the same construction.
In addition, the detected pressure, i.e. the meaning of voltage, is unintelligible to the user.
Further, when adjusting treating conditions of the apparatus, the adjustment must be carried out in a way suited for each individual apparatus, resulting in increased man-hours.

Method used

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  • Substrate treating apparatus and method
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  • Substrate treating apparatus and method

Examples

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embodiment 1

[0037] Embodiment 1 of this invention will be described hereinafter with reference to the drawings.

[0038]FIG. 1 is a block diagram showing an outline of a substrate treating apparatus in Embodiment 1. This embodiment will be described by taking, for example, an apparatus for etching substrates (e.g. semiconductor wafers) as immersed in a heated treating solution which is a mixture of phosphoric acid (H3PO4) as a chemical and deionized water as a diluent.

[0039] The substrate treating apparatus has a treating tank 1 for storing the treating solution. A collecting tank 2 disposed around the treating tank 1 for collecting the treating solution overflowing the treating tank 1. The treating solution collected in the collecting tank 2 is returned to the treating tank 1 through a circulating system 3. The circulating system 3 includes piping 4 connecting the collecting tank 2 to jet pipes la disposed at the bottom of the treating tank 1. The piping 4 has a solution transmitting pump 5, an...

embodiment 2

[0075] Embodiment 2 of this invention will be described hereinafter with reference to the drawings.

[0076] Reference is made to FIG. 1 since the apparatus has a similar construction to what is shown in Embodiment 1.

[0077] The substrate treating apparatus has a treating tank 1 for storing the treating solution. A collecting tank 2 disposed around the treating tank 1 for collecting the treating solution overflowing the treating tank 1. The treating solution collected in the collecting tank 2 is returned to the treating tank 1 through a circulating system 3. The circulating system 3 includes piping 4 connecting the collecting tank 2 to jet pipes la disposed at the bottom of the treating tank 1. The piping 4 has a solution transmitting pump 5, an in-line heater 6 and a filter 7 arranged thereon. The in-line heater 6 is provided for heating, in the circulating system 3, the treating solution returned to the treating tank 1. The filter 7 is provided for removing particles from the treati...

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Abstract

A substrate treating apparatus for treating substrates with a treating solution having a mixture of a chemical and a diluent. The apparatus includes a treating tank for storing the treating solution, a heating device for heating the treating solution, a supply pipe for supplying a gas at a fixed flow rate, the supply pipe having a detecting end at a predetermined depth in the treating tank, a pressure detecting device for detecting a pressure in the supply pipe, a converting device for converting the pressure detected by the pressure detecting device into a voltage, a storage device for storing, as a reference voltage, a voltage received from the converting device when a reference liquid at a reference temperature is stored in the treating tank, and a computing device for deriving an actual specific gravity of the treating solution from the reference voltage stored in the storage device, and a treatment voltage received from the converting device when the treating solution stored in the treating tank has been heated to a treating temperature by the heating device.

Description

BACKGROUND OF THE INVENTION [0001] (1) Field of the Invention [0002] This invention relates to substrate treating apparatus and methods for treating, with a treating solution, substrates such as semiconductor wafers, glass substrates for liquid crystal displays and glass substrates for photomasks (hereinafter simply called “substrates”). [0003] (2) Description of the Related Art [0004] A conventional apparatus of the type noted above has a nitrogen gas source, a regulator, a supply pipe and a pressure detector (Japanese Unexamined Patent Publication No. 11-219931 (1999), (paragraphs “0040” to “0050” and FIG. 2), for example). This apparatus supplies nitrogen gas at a constant flow rate from the nitrogen gas source into a treating tank, with a detection end of the supply pipe disposed at a predetermined depth in the tank. The pressure detector detects a pressure of the nitrogen gas supplied into the treating tank. The pressure detected in this way is a pressure at the predetermined d...

Claims

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Application Information

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IPC IPC(8): F01N3/20
CPCH01L21/67057H01L21/67086H01L21/67253
InventorTAKAHASHI, HIROAKI
OwnerDAINIPPON SCREEN MTG CO LTD