Method for directing power to a hot swapped circuit board

a technology of hot swapping and circuit boards, applied in the direction of power supply for data processing, electrical apparatus construction details, instruments, etc., can solve the problems that neither the component nor the user can be damaged or injured by removing or installing

a technology of hot swapping and circuit boards, applied in the direction of power supply for data processing, electrical apparatus construction details, instruments, etc., can solve the problems that neither the component nor the user can be damaged or injured by removing or installing

US20090034221A1Inactive Publication Date: 2009-02-05IBM CORP

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for directing power to a hot swapped circuit board
  • Method for directing power to a hot swapped circuit board
  • Method for directing power to a hot swapped circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020]The present invention provides a chassis that receives a cassette, supplies power to the cassette, and communicates with electronic components on the cassette, such as an electronic circuit, board. The chassis comprises a first electronic circuit board with a first connector to receive a second electronic circuit board with a second connector. The cassette and the chassis selectively cooperate in a predetermined manner to align the second connector with the first connector. The first electronic circuit board has a first connector that receives a second electronic circuit board and supplies power to the second electronic circuit board. A typical example of a first electronic circuit board is a motherboard.

[0021]The chassis further comprises chassis flex circuitry including a pair of contacts arranged to contact cassette flex circuitry when the cassette is received by the chassis. The cassette flex circuitry and the chassis Hex circuitry complete a circuit when there is contact ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Method for controlling power and communications between to an electronic circuit board. A chassis includes a first electronic circuit board with a first connector and a cassette includes a second electronic circuit board with a second connector. When the cassette is received by the chassis, chassis flex circuitry and cassette flex circuitry come into contact to complete a circuit between the components. Closing the circuit indicates to a controller that the cassette is properly secured to the chassis and that a user is not attempting removal of the cassette. The controller instructs a power source to provide power to the second electronic circuit board through the first connector. When the circuit is broken by a user, the controller causes the completion of operations on the second electronic circuit board and causes the power source to stop supplying power to the second electronic circuit board.

Description

[0001]This nonprovisional application is a divisional application of US nonprovisional application Ser. No. 11 / 679,703 filed on Feb. 27, 2007.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to methods for directing power to a hot-swappable computer component when inserted, and safely powering down the component prior to removal.[0004]2. Description of the Related Art[0005]Hot swappable components have become commonplace in computer systems. Server systems often use hot swappable memory, hard drives, and various pieces of hardware commonly referred to as Peripheral Component Interconnect (PCI) cards. Hot swapping may involve the removal of a piece of hardware, or the insertion of a piece of hardware, or both while the computer is on and functioning. While the following discussion refers to PCI cards, the problems presented are equally applicable to any other hot swappable electronic circuit board.[0006]Computer systems that support hot sw...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
05 Feb 2009
Publication
US20090034221A1
IPC
H05K7/18; H05K7/14; G06F13/00
CPC
G06F13/4081; H05K7/1414; H05K1/147; G06F1/16; G06F1/1601; G06F1/26; G06F13/40
Inventors
KERRIGAN, BRIAN MICHAEL