Heat-dissipating device
a heat dissipation device and heat dissipation technology, which is applied in semiconductor devices, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of uneven heat dissipation of leds (21a) to (21d) of each column thereof, and the effect of working fluid on reducing the temperature of leds
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[0020]Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
[0021]Referring to FIGS. 3, 4, and 5, the first preferred embodiment of a heat-dissipating device according to the present invention is used to dissipate heat from a plurality of heat sources 31. The heat-dissipating device includes a plurality of elongated thermally conductive elements 4 each having a first end 41 adapted to thermally contact a respective one of the heat sources 31 and a second end 42 opposite to the first end 41. The heat-dissipating device further includes a fin structure 5 connected to the thermally conductive elements 4. The thermally conductive elements 4 pass through the fin structure 5.
[0022]Preferably, the fin structure 5 includes a plurality of spaced-apart plate-shaped fins that are parallel to each other. In this embodiment, the heat sources 31 are light-emitting diodes (LEDs), and e...
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