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Heat-dissipating device

a heat dissipation device and heat dissipation technology, which is applied in semiconductor devices, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of uneven heat dissipation of leds (21a) to (21d) of each column thereof, and the effect of working fluid on reducing the temperature of leds

Inactive Publication Date: 2009-09-24
LUO CHIN KUANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a heat-dissipating device that can effectively dissipate heat from multiple heat sources. The device includes elongated thermally conductive elements and a fin structure connected to the conductive elements. This design overcomes the limitations of previous heat-dissipating devices and ensures efficient heat transfer."

Problems solved by technology

However, a drawback of this configuration is that the heat from the LEDs (21a) to (21d) of each column thereof is not uniformly dissipated.
A significant drawback of this conventional heat-dissipating device is that the working fluid may be too hot by the time it reaches the last LED (21d).
As a consequence, the working fluid becomes less effective for reducing the temperature of the LED (21d).
Ultimately, this leads to a reduction in the illumination uniformity of the light-emitting unit 2.

Method used

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Embodiment Construction

[0020]Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.

[0021]Referring to FIGS. 3, 4, and 5, the first preferred embodiment of a heat-dissipating device according to the present invention is used to dissipate heat from a plurality of heat sources 31. The heat-dissipating device includes a plurality of elongated thermally conductive elements 4 each having a first end 41 adapted to thermally contact a respective one of the heat sources 31 and a second end 42 opposite to the first end 41. The heat-dissipating device further includes a fin structure 5 connected to the thermally conductive elements 4. The thermally conductive elements 4 pass through the fin structure 5.

[0022]Preferably, the fin structure 5 includes a plurality of spaced-apart plate-shaped fins that are parallel to each other. In this embodiment, the heat sources 31 are light-emitting diodes (LEDs), and e...

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Abstract

A heat-dissipating device is used for dissipating heat from a plurality of heat sources. The heat-dissipating device includes a plurality of elongated thermally conductive elements each having an end adapted to thermally contact a respective one of the heat sources, and a fin structure connected to the thermally conductive elements.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority of Taiwanese application no. 097109858, filed on Mar. 20, 2008.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates to a heat-dissipating device, more particularly to a heat-dissipating device for dissipating heat individually from a plurality of heat sources so as to ensure uniform heat dissipation thereamong.[0004]2. Description of the Related Art[0005]As shown in FIGS. 1 and 2, Taiwanese Utility Model Patent No. M326999 discloses a heat-dissipating device 1 for dissipating heat from a light-emitting unit 2 which includes a plurality of light-emitting diodes (LEDs) (21a) to (21d). The heat-dissipating device 1 includes a base 11, and the light-emitting unit 2 is mounted on the base 11 in an array configuration of a plurality of columns of the LEDs (21a) to (21d). The heat-dissipating device 1 further includes a plurality of fins 12 mounted on the base 11 and stacked in a ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F7/00
CPCF21V29/004F21V29/006F21V29/02F21V29/2212F21Y2101/02F28D15/0275F21V29/763H01L23/427H01L2924/0002H01L23/3672F21V29/717H01L2924/00F21Y2115/10F28F1/32F21V29/67F21V29/777F21V29/51
Inventor LUO, CHIN-KUANG
Owner LUO CHIN KUANG