Heat dissipation device

Abstract

A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure relates to heat dissipation, and particularly to a heat dissipation device for dissipating heat generated by an electronic component.[0003]2. Description of Related Art[0004]Electronic components operating at high speed generate excessive heat which must be displaced efficiently to ensure normal operation. Typically, a heat dissipation device attached to the electronic component provides such heat dissipation.[0005]A conventional heat dissipation device includes a metal base for contacting and absorbing heat from the electronic component, a straight heat pipe with an evaporator section thereof attached to the base, and a heat sink including a plurality fins attached to a condenser section of the heat pipe. By this configuration, firstly, the heat generated by the electronic component is conducted to the base, and then transferred to the heat sink through the heat pipe, and finally is dissipated to ambient by the fins.[0006]For e...

AI Technical Summary

Problems solved by technology

Electronic components operating at high speed generate excessive heat which must be displaced efficiently to ensure normal operation.

However, a heat contacting area between the heat pipe and the heat sink, due to the restriction by the configurations of the heat pipe and the heat sink, cannot be increased.

Thus, most of heat generated by the electronic component and absorbed by the evaporator section of the heat pipe can not be transferred to the heat sink timely, and therefore the heat dissipation effectiveness of the heat dissipation device is limited.

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