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Clip and heat sink assembly having the same

Inactive Publication Date: 2010-04-22
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0004]A heat sink is usually placed in thermal contact with a heat generating electronic device such a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device. Usually, a heat sink is secured to the heat generating electronic device by using a clip. Generally, the clip is secured to the heat sink by several bolts to get a heat sink assembly. In assembling and disassembling processes of the heat sink assembly, additional tools are needed, and these processes are complex and time-consuming.

Problems solved by technology

In assembling and disassembling processes of the heat sink assembly, additional tools are needed, and these processes are complex and time-consuming.

Method used

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  • Clip and heat sink assembly having the same
  • Clip and heat sink assembly having the same
  • Clip and heat sink assembly having the same

Examples

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Embodiment Construction

[0011]An embodiment will now be described in detail below and with reference to the drawings.

[0012]Referring to FIG. 1, an exemplary embodiment of a heat sink assembly 100 includes a heat sink 10 and two clips 20. The heat sink 10 is configured for thermally connecting with a heat generating electronic device (not shown) on a printed circuit board (not shown). The two clips 20 are configured for securing the heat sink 10 to the heat generating electronic device by fastening the two clips 20 to the printed circuit board.

[0013]The heat sink 10 is an integral structure and made of a thermally conductive material such as copper, aluminum, or an alloy thereof. The heat sink 10 includes a base 11 and a fin array 12 extending from a top surface of the base 11. The fin array 12 is composed of a number of fins parallel and spaced with each other. The fin array 12 includes two outermost fins 121 respectively extending from two opposite ends of the top surface of the base 11. Each of the two o...

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PUM

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Abstract

A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a fin extending upwardly from the base. The clip is mounted on the fin and can be removed therefrom by moving upwardly along a height direction of the fin. The clip includes a resisting part contacting with a side of the fin, two locking parts respectively connected to two ends of the resisting part for securing the heat sink to a printed circuit board, and two stopping parts engaging with two opposites ends and an opposite side of the fin for preventing the clip from moving along widthwise and thickness directions of the fin. The two stopping parts are connected to the resisting part and located between the two locking parts.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to clips and, particularly, to a clip capable of being conveniently assembled to and disassembled from a heat sink, and a heat sink assembly having such a heat sink and clip.[0003]2. Description of Related Art[0004]A heat sink is usually placed in thermal contact with a heat generating electronic device such a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device. Usually, a heat sink is secured to the heat generating electronic device by using a clip. Generally, the clip is secured to the heat sink by several bolts to get a heat sink assembly. In assembling and disassembling processes of the heat sink assembly, additional tools are needed, and these processes are complex and time-consuming.[0005]What is needed, therefore, is a clip capable of being convenien...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/4006H01L2023/405H01L2023/4081H01L2023/4087H01L2924/0002H01L2924/00
Inventor WANG, XIN-JIANLU, CUI-JUN
Owner FU ZHUN PRECISION IND SHENZHEN
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