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Heat exchanger

a technology of heat exchanger and heat exchanger plate, which is applied in the direction of heating apparatus, machines using electric/magnetic effects, refrigerating machines, etc., can solve the problems of affecting heat exchange capacity, lowering heat exchange efficiency, and reducing the durability of coupled portions and semiconductor elements, so as to achieve heat exchange efficiency

Inactive Publication Date: 2011-02-10
TOYOTA IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]It is an object of the present invention to provide a heat exchanger that performs heat exchange efficiently and includes a plurality of P type thermoelectric semiconductor elements and a plurality of N type thermoelectric semiconductor elements that are electrically connected in series and thermally arranged in parallel.

Problems solved by technology

This structure produces thermal resistance that lowers the efficiency of heat transfer.
This lowers the durability of the coupled portions and the semiconductor elements.
This forms a boundary layer when fluid flows in parallel with the heat exchange surface and greatly affects the heat exchange capacity.
This increases the burden on manufacturing and raises the manufacturing cost.
This lowers durability.

Method used

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first embodiment

[0031]the present invention will now be discussed with reference to FIGS. 1 to 5.

[0032]Referring to FIG. 1, a heat exchanger includes a thermoelectric module 11. A first fluid 12 flows through a first fluid passage 13, which is located at a heat dissipation side (upper side as viewed in FIG. 1) of the thermoelectric module 11. A second fluid 14 flows through a second fluid passage 15, which is located at a heat absorption side (lower side as viewed in FIG. 1) of the thermoelectric module 11.

[0033]The thermoelectric module 11 includes a plurality of P type thermoelectric semiconductor elements 16 and a plurality of N type thermoelectric semiconductor elements 17. The P type thermoelectric semiconductor elements 16 and the N type thermoelectric semiconductor elements 17 are electrically connected in series by electrodes and thermally arranged in parallel. The phrase “thermally arranged in parallel” refers to a state in which the P type thermoelectric semiconductor elements 16 and N ty...

third embodiment

[0071]In the third embodiment, the valleys and ridges on the heat dissipation side and heat absorption side of the thermoelectric module 11 are provided without arranging the end faces of the P type thermoelectric semiconductor elements 16 and N type thermoelectric semiconductor elements 17 on the same plane. Further, the end faces of the P type thermoelectric semiconductor elements 16 and N type thermoelectric semiconductor elements 17 are arranged in rows, the locations of which are alternately varied. However, the present invention is not limited to such a structure. For example, the locations of just one half of the end faces in each row may be alternately varied. Alternatively, the locations of every single end face or every two end faces may be alternately varied.

[0072]In the third embodiment, the electrical insulator 21 that couples the P type thermoelectric semiconductor elements 16 and the N type thermoelectric semiconductor elements 17 do not necessarily have to be formed ...

fourth embodiment

[0076]In addition to the fourth embodiment, the other embodiments may also include the packing 24 that is formed around the thermoelectric module 11 and attaches the thermoelectric module 11 between the first fluid passage 13 and the second fluid passage 15.

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Abstract

A heat exchanger includes a thermoelectric module. A first fluid passage is arranged at a heat dissipation side of the thermoelectric module and a second fluid passage is arranged at a heat absorption side of the thermoelectric module. The thermoelectric module includes P type and N type thermoelectric semiconductor elements. An electrical insulator couples the P type and N type thermoelectric semiconductor elements. Heat dissipation side electrodes are exposed in the first fluid passage and heat absorption side electrodes are exposed in the second fluid passage. At least the heat dissipation side of the thermoelectric module includes valleys and ridges with the heat dissipation side electrode being free from projections.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to a heat exchanger, and more particularly, to a heat exchanger including a thermoelectric module (Peltier module) in which a plurality of P type thermoelectric semiconductor elements and a plurality of N type thermoelectric semiconductor elements are electrically connected in series by electrodes and thermally arranged in parallel.[0002]FIG. 11A shows the structure of a typical thermoelectric module 50 that allows for mutual conversion of heat energy and electrical energy. The thermoelectric module 50 includes a plurality of P type thermoelectric semiconductor elements 51 and a plurality of N type thermoelectric semiconductor elements 52. The P type thermoelectric semiconductor elements 51 and the N type thermoelectric semiconductor elements 52 are alternately arranged on a two dimensional plane and electrically connected in series by electrodes 53. When the thermoelectric module 50 is supplied with DC current, heat is ...

Claims

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Application Information

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IPC IPC(8): F25B21/02
CPCH01L35/30H10N10/13
Inventor MORISAKU, NAOTOAKIYAMA, HIROKUNI
Owner TOYOTA IND CORP