Heat exchanger
a technology of heat exchanger and heat exchanger plate, which is applied in the direction of heating apparatus, machines using electric/magnetic effects, refrigerating machines, etc., can solve the problems of affecting heat exchange capacity, lowering heat exchange efficiency, and reducing the durability of coupled portions and semiconductor elements, so as to achieve heat exchange efficiency
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first embodiment
[0031]the present invention will now be discussed with reference to FIGS. 1 to 5.
[0032]Referring to FIG. 1, a heat exchanger includes a thermoelectric module 11. A first fluid 12 flows through a first fluid passage 13, which is located at a heat dissipation side (upper side as viewed in FIG. 1) of the thermoelectric module 11. A second fluid 14 flows through a second fluid passage 15, which is located at a heat absorption side (lower side as viewed in FIG. 1) of the thermoelectric module 11.
[0033]The thermoelectric module 11 includes a plurality of P type thermoelectric semiconductor elements 16 and a plurality of N type thermoelectric semiconductor elements 17. The P type thermoelectric semiconductor elements 16 and the N type thermoelectric semiconductor elements 17 are electrically connected in series by electrodes and thermally arranged in parallel. The phrase “thermally arranged in parallel” refers to a state in which the P type thermoelectric semiconductor elements 16 and N ty...
third embodiment
[0071]In the third embodiment, the valleys and ridges on the heat dissipation side and heat absorption side of the thermoelectric module 11 are provided without arranging the end faces of the P type thermoelectric semiconductor elements 16 and N type thermoelectric semiconductor elements 17 on the same plane. Further, the end faces of the P type thermoelectric semiconductor elements 16 and N type thermoelectric semiconductor elements 17 are arranged in rows, the locations of which are alternately varied. However, the present invention is not limited to such a structure. For example, the locations of just one half of the end faces in each row may be alternately varied. Alternatively, the locations of every single end face or every two end faces may be alternately varied.
[0072]In the third embodiment, the electrical insulator 21 that couples the P type thermoelectric semiconductor elements 16 and the N type thermoelectric semiconductor elements 17 do not necessarily have to be formed ...
fourth embodiment
[0076]In addition to the fourth embodiment, the other embodiments may also include the packing 24 that is formed around the thermoelectric module 11 and attaches the thermoelectric module 11 between the first fluid passage 13 and the second fluid passage 15.
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