CPU cooling circuit having thermoelectric element

Abstract

A CPU cooling circuit for a CPU includes a thermoelectric element and a current source circuit. The thermoelectric element includes a first thermoelectric substrate attached to the CPU, a second thermoelectric substrate opposite to the first thermoelectric substrate, a plurality of n-type semiconductor units and p-type semiconductor units alternately sandwiched between the first and the second thermoelectric substrates and electrically connected in series between a positive power supply input and a negative power supply input. The current source circuit is configured for providing driving current to flow through the n-type semiconductor units and the p-type semiconductor units of the thermoelectric element according to a temperature of the CPU.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a central processing unit (CPU) cooling circuit, and more particularly, to CPU cooling circuit having thermoelectric element.[0003]2. Description of Related Art[0004]During operation of an electronic element of an electronic device, such as a central processing unit (CPU) of a computer, a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent unstable operation or damage to the CPU. Typically, a heat sink made of aluminum or copper is attached to an outer surface of the CPU to absorb the heat from the CPU. The heat absorbed by the heat sink is then dissipated to the ambient air via a fan attached on the heat sink. However, dissipating heat to air is slow and inefficient. In addition, when the temperature of the CPU is high, the fan will keep operating at a high-speed of rotation, which wastes electric power and shortens the life of the fan.[0005]Therefore, a new system...

AI Technical Summary

Benefits of technology

[0004]During operation of an electronic element of an electronic device, such as a central processing unit (CPU) of a computer, a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent unstable operation or damage to the CPU. Typically, a heat sink made of aluminum or copper is attached to an outer surface of the CPU to absorb the heat from the CPU. The heat absorbed by the heat sink is then dissipated to the ambient air via a fan attached on the heat sink. However, dissipating heat to air is slow and inefficient. In addition, when the temperature of the CPU is high, the fan will keep operating at a high-speed of rotation, which wastes electric power and shortens the life of the fan.

Problems solved by technology

During operation of an electronic element of an electronic device, such as a central processing unit (CPU) of a computer, a large amount of heat is often produced.

However, dissipating heat to air is slow and inefficient.

In addition, when the temperature of the CPU is high, the fan will keep operating at a high-speed of rotation, which wastes electric power and shortens the life of the fan.

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