Profile and method of forming same
a technology of profile and forming method, applied in the field of profiles, can solve the problems of reducing the thickness of the profile, limiting the maximum possible reduction of the thickness, and loss of stiffness, and achieve the effect of improving the stiffness of the material-optimized profil
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024]A profile 11 according to the present invention, which is shown in FIGS. 1-2, has a C-shaped cross-section with two, extending parallel to each other, side walls 12 and a connection section 13 that connects the two side walls 12 with each other. A bend 17 is provided between each of the side walls 12 and the connection section 13. The free ends 14 of the side walls 12 are bent inward and, thus, have each a bend 18. The side walls 12 partially enclose a hollow space 19. The profile 11 extends along a longitudinal axis 15.
[0025]The profile 11 is formed of a strip-shaped rolling stock with an initial material thickness W and has two thickness-reduced sections 16 in the two side walls 12, respectively. The thickness-reduced sections 16 have a material thickness D that is smaller than the initial material thickness W. On opposite sides of each of the thickness-reduced sections 16, there are provided thickened regions 21, 22, respectively, which are formed by material accumulation a...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
stiffness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com