Fin assmebly and heat dissipation device using the same
a technology of fins and heat dissipation devices, which is applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of low utilization efficiency of airflow and huge airflow at the two ends of air outlets
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0011]FIGS. 1, 2 and 3 show a heat dissipation device 100 in accordance with an exemplary embodiment. The heat dissipation device 100 includes a fan 10, and a fin assembly 20 adjacent to the fan 10.
[0012]The fan 10 includes a casing 12, and an impeller 14 received in the casing 12. The impeller 14 includes a hub 142, and a plurality of blades 144 extending radially and outwardly from a periphery of the hub 142. The casing 12 includes a top cover 123, a bottom plate 124, and a sidewall 126 connecting the top cover 123 with the bottom plate 124. The top cover 123, the bottom plate 124 and the sidewall 126 cooperatively define a receiving space (not labeled) receiving the impeller 14.
[0013]The top cover 123 defines an air inlet 121 at a center thereof. The impeller 14 is rotatably connected to the top cover 123 with the hub 142 thereof aligned with the air inlet 121 of the top cover 123. The sidewall 126 defines an air outlet 122 between two ends of the sidewall 126, perpendicular to t...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


