Semiconductor packaging method and structure thereof

Abstract

A semiconductor packaging method includes providing a substrate having a plurality of pads, each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conductive contact areas; forming a conductible gel with anti-dissociation function on the substrate, said conductible gel includes a plurality of conductive particles and a plurality of anti-dissociation substances; mounting a chip on the substrate, said chip comprises a plurality of copper-containing bumps, each of the copper-containing bumps comprises a ring surface and a second coupling surface having a plurality of second conductive contact areas and a plurality of second non-conductive contact areas, wherein the conductive particles are electrically connected with the first conductive contact areas and the second conductive contact areas, said anti-dissociation substances are in contact with the second non-conductive contact area, and the ring surfaces are covered with the anti-dissociation substances.

Description

FIELD OF THE INVENTION[0001]The present invention is generally related to a semiconductor packaging method, which particularly relates to the semiconductor packaging method that prevents copper ions from dissociation.BACKGROUND OF THE INVENTION[0002]Modern electronic products gradually lead a direction of light, thin, short, and small. Accordingly, the circuit layout for electronic products destines to develop technique such as “micro space between two electronic connection devices”. However, a short phenomenon is easily occurred in mentioned circuit layout via an insufficient gap between two adjacent electronic connection devices.SUMMARY[0003]The primary object of the present invention is to provide a semiconductor packaging method includes providing a substrate having an upper surface and a plurality of pads disposed at the upper surface, and each of the pads comprises a first coupling surface having a plurality of first conductive contact areas and a plurality of first non-conduc...

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor packaging method that includes using a conductive gel with anti-dissociation function to prevent short circuits caused by copper ions. This method involves mounting a chip on a substrate with pads, forming a conductive gel with anti-dissociation function on the pads, and connecting the chip's copper bumps to the pads' conductive areas through the conductive particles in the gel. The anti-dissociation substances in the gel capture any dissociated copper ions, preventing them from causing short circuits. This ensures the stability and reliability of the semiconductor packaging.

Problems solved by technology

However, a short phenomenon is easily occurred in mentioned circuit layout via an insufficient gap between two adjacent electronic connection devices.

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