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Nonvolatile semiconductor memory device and method of manufacturing the same

a semiconductor memory and non-volatile technology, applied in the direction of semiconductor devices, electrical devices, transistors, etc., can solve the problems of metal contamination, short circuit between each element,

Inactive Publication Date: 2016-12-22
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a nonvolatile semiconductor memory device and a method of manufacturing it. The device includes a memory cell array with a plurality of memory cells connected to a bit line and a word line. A column control circuit controls the bit line and performs data erase, data write, and data read of the memory cells. A data input / output buffer receives and sends data to and from an external host. The patent aims to achieve miniaturization of the memory device while preventing short circuits and metal contamination. The technical effects of the patent include improved miniaturization of the memory device while preventing short circuits and metal contamination.

Problems solved by technology

However, as a result of miniaturization, sometimes, a short circuit occurs between each of elements, or metal contamination occurs.

Method used

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  • Nonvolatile semiconductor memory device and method of manufacturing the same
  • Nonvolatile semiconductor memory device and method of manufacturing the same
  • Nonvolatile semiconductor memory device and method of manufacturing the same

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Experimental program
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first embodiment

Overall Configuration

[0015]FIG. 1 is a block diagram of a nonvolatile semiconductor memory device according to a first embodiment. This nonvolatile semiconductor memory device includes a memory cell array 101 that has a plurality of memory cells MC disposed substantially in a matrix therein and that comprises a bit line BL and a word line WL disposed orthogonally to each other and connected to these memory cells MC. Provided in a periphery of this memory cell array 101 are a column control circuit 102 and a row control circuit 103. The column control circuit 102 controls the bit line BL and performs data erase of the memory cell, data write to the memory cell, and data read from the memory cell. The row control circuit 103 selects the word line WL and applies a voltage for data erase of the memory cell, data write to the memory cell, and data read from the memory cell.

[0016]A data input / output buffer 104 is connected to an external host 109, via an I / O line, and receives write data,...

second embodiment

[0060]Next, a nonvolatile semiconductor memory device according to a second embodiment will be described with reference to FIGS. 20 and 21. An overall configuration of the nonvolatile semiconductor memory device of this second embodiment has a circuit configuration and a planar layout of the memory cell array 101 which are identical to those of the first embodiment (FIGS. 1 to 3), hence duplicated descriptions thereof will be omitted. However, a cross-sectional structure of the memory cell is different from that of the first embodiment. Moreover, FIG. 20 is a cross-sectional view taken along the line I-I′ of FIG. 3 and FIG. 21 is a cross-sectional view taken along the line II-II′ of FIG. 3, of the nonvolatile semiconductor memory device according to the second embodiment. In FIGS. 20 and 21, configurations identical to those of the first embodiment are assigned with identical reference symbols to those assigned in FIGS. 4 and 5, and duplicated descriptions thereof will be omitted be...

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Abstract

A nonvolatile semiconductor memory device according to an embodiment comprises: a tunnel insulating film disposed on a semiconductor layer; a floating gate electrode disposed on the tunnel insulating film; a block insulating film disposed on the floating gate electrode; and a control gate electrode disposed on the block insulating film. The block insulating film is provided along a bottom surface and a side surface of the control gate electrode.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is based on and claims the benefit of priority from prior Japanese Patent Application NO. 62 / 182,939, filed on Jun. 22, 2015, the entire contents of which are incorporated herein by reference.FIELD[0002]Embodiments described herein relate to a nonvolatile semiconductor memory device and a method of manufacturing the same.BACKGROUNDDescription of the Related Art[0003]A memory cell configuring a nonvolatile semiconductor memory device such as a NAND type flash memory includes a semiconductor layer, a control gate, and a charge accumulation layer. The memory cell has its threshold voltage changed based on a charge accumulated in the charge accumulation layer and stores a magnitude of this threshold voltage as data. In recent years, further miniaturization has been required in such a nonvolatile semiconductor memory device. However, as a result of miniaturization, sometimes, a short circuit occurs between each of elements, or...

Claims

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Application Information

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IPC IPC(8): H01L29/788H01L29/66H01L21/28H01L27/115H01L29/423H01L29/51
CPCH01L29/42364H01L21/28273H01L27/11521H01L29/515H01L29/7883H01L29/42324H01L29/66825H01L21/764H01L29/40114H10B41/30H01L21/76
Inventor YAMANAKA, TAKAYASUGIURA, HIROTO
Owner KK TOSHIBA