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Flexible circuit board

a flexible circuit board and circuit technology, applied in the direction of printed circuits, printed circuit details, circuit bendability/stretchability, etc., can solve the problems of increasing the number of components, the effect of heat release is low, and affecting other electronic devices, so as to prevent unnecessary radiation

Inactive Publication Date: 2015-06-30
CANON COMPONENTS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]In view of the circumstances, an object of the present invention is to provide a flexible circuit board that can release heat of a circuit pattern, a mounted element, and the like without increasing the number of components or the assembly time and that can prevent unnecessary radiation.

Problems solved by technology

The flexible circuit board has a problem that high harmonic components of a digital signal flowing through the circuit pattern may be emitted as noise, and this may affect other electronic devices.
In the conventional configurations, the surfaces of the metal foil and the metallic base film are flat, and there is a problem that an effect of heat release is low.
However, the number of components and the assembly time increase according to the configuration, and this increases the cost of product and the manufacturing cost.

Method used

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Experimental program
Comparison scheme
Effect test

first embodiment

[0052]FIGS. 1 and 2 will be described in relation to a configuration of a flexible circuit board 1a according to a first embodiment. FIGS. 1 and 2 are perspective views schematically illustrating an overall configuration of the flexible circuit board 1a according to the first embodiment of the present invention. FIGS. 1 and 2 illustrate surfaces on opposite sides. FIG. 3 is a sectional view schematically illustrating a configuration of the flexible circuit board 1a according to the first embodiment of the present invention.

[0053]As illustrated in FIGS. 1 to 3, the flexible circuit board 1a includes a base film 11a, a first protective film 12, an adhesive film 13, a circuit pattern 14, and a second protective film 15.

[0054]The base film 11a is a flexible film formed by a metallic material. For example, aluminum foil with a thickness of 200 to 400 μm is applied as the base film 11a. The first protective film 12 is formed (described later) on one of the surfaces of the base film 11a (u...

second embodiment

[0078]A flexible circuit board 1b according to a second embodiment of the present invention will be described with reference to FIGS. 8 to 10. FIGS. 8 and 9 are perspective views schematically illustrating a configuration of the flexible circuit board 1b according to the second embodiment of the present invention. FIGS. 8 and 9 illustrate views as seen from opposite sides. FIG. 10 is a sectional view schematically illustrating that the flexible circuit board 1b according to the second embodiment of the present invention is attached to another member 401. The same parts as those of the flexible circuit board 1a according to the first embodiment are designated with the same reference numerals, and the descriptions will not be repeated.

[0079]The flexible circuit board 1b according to the second embodiment of the present invention includes a base film 11b, the first protective film 12, the adhesive film 13, the circuit pattern 14, and the second protective film 15.

[0080]Metal foil is ap...

third embodiment

[0088]A flexible circuit board 1c according to a third embodiment of the present invention will be described with reference to FIG. 11. FIG. 11 is a sectional view schematically illustrating a configuration of the flexible circuit board 1c according to the third embodiment of the present invention. The same parts as those of the flexible circuit board 1a according to the first embodiment of the present invention are designated with the same reference numerals, and the descriptions will not be repeated.

[0089]As illustrated in FIG. 11, the flexible circuit board 1c includes a base film 11c, the first protective film 12, the adhesive film 13, the circuit pattern 14, and the second protective film 15.

[0090]The base film 11c is a flexible film formed by a metallic material. An oxide film 117 is formed on the first surface 114 of the base film 11c. The oxide film 117 is an electrically insulating substance. The oxide film 117 may be or may not be formed on the second surface 115. It is on...

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PUM

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Abstract

A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2012-046914, filed on Mar. 2, 2012, and the Japanese Patent Application No. 2012-281408, filed on Dec. 25, 2012, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a flexible circuit board. More particularly, the present invention relates to a flexible circuit board including a circuit pattern formed on a surface of metal foil through an insulating layer.[0004]2. Description of the Related Art[0005]A conventionally known flexible circuit board (FPC) includes a circuit pattern made of conductive foil attached to a surface of a metallic base film by an adhesive (see Patent Document 1). According to the configuration described in Patent Document 1, the heat of an element and the like mounted on the flexible circuit board i...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K1/00H05K1/02H05K3/40H05K1/03
CPCH05K1/0277H05K1/0393H05K3/4092H05K2203/1545
Inventor HATTORI, YOSHIHIROASAI, SHOZO
Owner CANON COMPONENTS INC