The application provides a lower
electrode feed-in device and a
semiconductor processing equipment, the device comprises a
radio frequency feed-in
assembly, one end of the
radio frequency feed-in
assembly is used for electrically connecting with a
radio frequency source, and the other end is used for electrically connecting with a chuck
assembly; the radio frequency feed-in assembly comprises at least two radio frequency feed-in pipes and at least one radio frequency adapter
pipe; wherein, each two adjacent radio frequency feed-in pipes are provided with a first matching part, the radio frequency adapter
pipe is provided with two second matching parts, and the two second matching parts are matched with the first matching parts of the two adjacent radio frequency feed-in pipes respectively, so that the radio frequency adapter
pipe is detachably connected with the two adjacent radio frequency feed-in pipes and electrically connected. The scheme can not only more conveniently disassemble and assemble the radio frequency feed-in pipe, but also better ensure the assembly consistency of each
machine, and can select a
solid-state medium, so that the problem that the
solid-state medium is not easy to disassemble and assemble does not exist, thereby the occupied space of the lower
electrode feed-in device can be reduced, so that more space can be used for optimizing other lower
electrode components.