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Compositely packaged foil type manganin superhigh pressure sensor

A technology of ultra-high pressure and sensors, which is applied to the measurement of the properties and forces of piezoelectric resistance materials, etc., can solve the problems that embedded measurement cannot be used, the thickness of the sensor is thick, and the application range is limited, and it can achieve easy calibration and thickness Thinning, easy-to-use effect

Inactive Publication Date: 2007-10-31
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

But this kind of sensor is too thick to use embedded measurement, but can only work in the post-mounted mode—that is, the stress unbalanced mode
This mode requires that the impact mechanical constant of the material to be tested must be a known value, otherwise the pressure cannot be calibrated, so the application range of this type of sensor is very limited

Method used

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  • Compositely packaged foil type manganin superhigh pressure sensor
  • Compositely packaged foil type manganin superhigh pressure sensor
  • Compositely packaged foil type manganin superhigh pressure sensor

Examples

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Embodiment Construction

[0031] Manganese copper foil 8 with a thickness of 28 μm is selected, and it is firstly etched into an H-shaped pattern by photolithography. Then magnetron sputtering is used to deposit copper thin film 9 on the front and back sides of the lead position (shaded part in FIG. 4 ) of the manganin foil, with a film thickness of 2-5 μm. The manganese-copper foil and the lead constitute the pressure sensitive element 2 . Next, an aluminum oxide thin film 6 is deposited on the front and back sides of the pressure sensitive element 2 by electron beam evaporation, with a film thickness of 2-8 μm. Finally, sandwich the pressure-sensitive element coated with aluminum oxide film between two polytetrafluoroethylene films 3 and bond them together with a thin adhesive 4. The thickness of the polytetrafluoroethylene film is 250 μm.

[0032] The transient waveform diagram of the complete shock wave pressure recorded by the sensor in this specific embodiment is shown in FIG. 5 , the material o...

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Abstract

The invention discloses a composite packing foil-type manganin super-pressure sensor, which comprises the following parts: manganin voltage-sensitive element (2), organic insulating film (3), adhesive (4) and inorganic insulating film (6), wherein the inorganic insulating film (6) is composed of aluminum oxide and magnesium oxide, whose thickness is 1-30 mu m; the inorganic insulating film (6) is set on front-to-back face of manganin voltage-sensitive element (2), which makes the organic insulating film (3) on two faces of the inorganic insulating film (6) through adhesive (4). The invention realizes the organic-to-inorganic composite pack, which can measure the pressure more than 50 GPa with simple structure and high precision.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and devices, and in particular relates to manganin pressure sensor technology. [0002] Related to manganin pressure sensors, especially ultra-high pressure sensors. Background technique [0003] As we all know, manganese copper is a ternary alloy whose main components are copper (84-87%), manganese (11-13%) and nickel (2-3%), and has piezoresistive effect. The alloy does not undergo phase transformation under high pressure, and in principle, the pressure above 100GPa can be tested. However, the insulation performance of the packaging material of the sensor drops sharply under high voltage, forming a high-voltage bypass effect, which seriously attenuates the output signal of the sensor, and limits the increase of the upper limit of the manganin sensor's range. Therefore, the upper limit of the range of the manganin sensor is determined by the high-voltage insulation performance of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18
Inventor 杜晓松周鸿仁杨邦朝崔红玲
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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