The invention relates to a high-thermal-conductivity metal circuit board production method. The method includes 1, clipping a copper-clad plate; 2, grinding the plate; 3, printing the circuits; 2, detecting for the first time; 5, etching, namely placing the copper-clad plate with the printed circuit into etching equipment, utilizing etching potion to corrode the excess copper skin, washing the ink of the circuits, and drying; 6, drilling positioning holes; 7, washing for the first time; 8, printing silkscreen lines, printing designed circuit patterns on the back of a substrate, removing the exposed copper foil of the substrate by etching, then removing the protection ink; 9, washing for the second time; 10, welding in a resistant manner; 11, forming; 12, forming V pits; 13, detecting for the second time; 14, packing and discharging. The method has the advantages that the production process is simple, the heat conducting efficiency is high, and the metal substrate is not prone to drop off, and the method is environment-friendly.