High-thermal-conductivity metal circuit board production method
A metal circuit and production method technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems affecting the electrical, heat dissipation and mechanical properties of metal-based circuit boards, imperfect drying process, loose metal base, etc. Achieve good machining performance and strength, good dimensional stability, and excellent heat dissipation
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Embodiment 1
[0027] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:
[0028] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;
[0029] S2. Grinding board: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 20s at a baking temperature of 80°C;
[0030] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;
[0031] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;
[0032] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,
[0033] Cu 2+ 160g / L CL — 180g / L pH 8.1
[0034] Co...
Embodiment 2
[0046] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:
[0047] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;
[0048] S2. Grinding board: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 15 seconds at a baking temperature of 90°C;
[0049] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;
[0050] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;
[0051] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,
[0052] Cu 2+ 150g / L CL — 195g / L pH 8.5
[0...
Embodiment 3
[0065] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:
[0066] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;
[0067] S2. Grinding plate: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 10s at a baking temperature of 100°C;
[0068] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;
[0069] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;
[0070] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,
[0071] Cu 2+ 135g / L CL — 210g / L pH 8.8
[0072] C...
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