High-thermal-conductivity metal circuit board production method

A metal circuit and production method technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems affecting the electrical, heat dissipation and mechanical properties of metal-based circuit boards, imperfect drying process, loose metal base, etc. Achieve good machining performance and strength, good dimensional stability, and excellent heat dissipation

Inactive Publication Date: 2014-12-10
SICHUAN HAIYING ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the functions of electronic products are increasingly enhanced and their popularity is getting higher and higher, the requirements for printed circuit boards used in electronic products are also increased accordingly. In the overshoot of printed circuits, the metal-based circuit boards in the prior art need Keep the board clean and tidy at all times. In order to achieve this effect, cleaning or grinding must be carried out during the production process. After washing, it must be dried. However, it is difficult to combine metal materials with common printed circuit boards. The drying process is not perfect, resulting in metal base loosening, falling off, poor contact and other phenomena during the drying step, which seriously affects the electrical, heat dissipation and mechanical properties of the metal base circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:

[0028] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;

[0029] S2. Grinding board: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 20s at a baking temperature of 80°C;

[0030] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;

[0031] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;

[0032] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,

[0033] Cu 2+ 160g / L CL — 180g / L pH 8.1

[0034] Co...

Embodiment 2

[0046] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:

[0047] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;

[0048] S2. Grinding board: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 15 seconds at a baking temperature of 90°C;

[0049] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;

[0050] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;

[0051] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,

[0052] Cu 2+ 150g / L CL — 195g / L pH 8.5

[0...

Embodiment 3

[0065] A production method of a high thermal conductivity metal circuit board, which comprises the following steps:

[0066] S1. Cutting the copper clad laminate: according to the design size, cut the copper clad laminate;

[0067] S2. Grinding plate: Send the cut copper clad laminate into the grinding machine for surface dust removal and deburring, and bake the copper clad laminate for 10s at a baking temperature of 100°C;

[0068] S3. Printed circuit: use anti-corrosion ink to print the circuit diagram on the copper clad board with the copper skin side;

[0069] S4. One-time inspection: remove the excess ink in the above step S3, and add ink to the part with less ink printed, so that the circuit diagram is consistent with MI;

[0070] S5. Etching: Put the copper clad laminate printed with the circuit diagram into the etching equipment, and the proportion of the etching potion is as follows,

[0071] Cu 2+ 135g / L CL — 210g / L pH 8.8

[0072] C...

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PUM

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Abstract

The invention relates to a high-thermal-conductivity metal circuit board production method. The method includes 1, clipping a copper-clad plate; 2, grinding the plate; 3, printing the circuits; 2, detecting for the first time; 5, etching, namely placing the copper-clad plate with the printed circuit into etching equipment, utilizing etching potion to corrode the excess copper skin, washing the ink of the circuits, and drying; 6, drilling positioning holes; 7, washing for the first time; 8, printing silkscreen lines, printing designed circuit patterns on the back of a substrate, removing the exposed copper foil of the substrate by etching, then removing the protection ink; 9, washing for the second time; 10, welding in a resistant manner; 11, forming; 12, forming V pits; 13, detecting for the second time; 14, packing and discharging. The method has the advantages that the production process is simple, the heat conducting efficiency is high, and the metal substrate is not prone to drop off, and the method is environment-friendly.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a production method of a metal circuit board with high thermal conductivity. Background technique [0002] In 2006, the total annual output value of printed circuit boards in my country exceeded 80 billion yuan, surpassing Japan and the United States to become the world's largest producer of printed circuit boards. Regrettably, due to the late start of printed circuit technology in our country, there is still a large gap with foreign developed countries in terms of preparation technology. [0003] Metal-based copper clad laminate is a composite material made of metal plate, insulating dielectric layer and copper foil. It is a special substrate material used to make printed circuit boards. It has excellent heat dissipation and is mainly used in military, aviation, Medical electronics and other fields. As the functions of electronic products are increasingly enhanced and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 李旭
Owner SICHUAN HAIYING ELECTRONICS TECH
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