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Packing structure of LED

A light-emitting diode and packaging structure technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as inability to cope with high heat requirements, and achieve the effect of increasing service life and reducing damage

Inactive Publication Date: 2008-03-05
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the width design of the bent portion 16a / 17a of the conductive layer 16 / 17 obviously cannot cope with the high heat requirement

Method used

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  • Packing structure of LED
  • Packing structure of LED
  • Packing structure of LED

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Experimental program
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Embodiment Construction

[0046] In order to improve the poor heat dissipation efficiency of the conventional LED packaging structure, a preferred embodiment of the present invention proposes a new packaging structure. In this novel package structure, the conductive layer does not reduce its width at the bent part. In addition, in order to make the bending process easier, a V-shaped notch is designed in the bending in this preferred embodiment.

[0047] Please refer to FIGS. 2A and 2B , which illustrate a top view and a side view of a light emitting diode package structure according to a preferred embodiment of the present invention. The base 21 has a recess for fixing the photoelectric component. The material of the base 21 can be epoxy resin, glass fiber, titanium oxide, calcium oxide, liquid crystal polymer, ceramics and other materials. The LED chips 28 are electrically connected to the conductive layers 26 / 27 through wires 31a / 31b, respectively. The conductive layer 26 / 27 also includes a V-shap...

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Abstract

The invention consists a base on which there is a sag. The base consists of a conducting layer, and part of it is fixed in the base and is exposed in the sag. The other part of conducting layer expands from inside to outside, and width of its buckling part is equal to or more than the other part of conducting layer. The light emitting diode is fixed in the sag, and connected with the conducting layer. The molding material is filled into the sag to encapsulate the light emitting diodes. The packaging structure reduces the damage to photoelectricity component due to temperature rise.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure, in particular to an improved light-emitting diode packaging structure. Background technique [0002] In recent years, the use of light-emitting diode components in the lighting field has shown an exponential growth. For example, light emitting diodes are widely used in mobile phones, PDAs and other electronic products. [0003] Please refer to the top view and side view of a known LED packaging structure shown in FIGS. 1A and 1B . The LED chip 18 is fixed in the concave portion of the base 11 . The base 11 fixes two conductive layers 16 / 17 for electrical connection with the LED chip 18 . Due to technical requirements (making the conductive layer 16 / 17 easy to bend), the width of the bent portion 16a / 17a of the conductive layer 16 / 17 is designed to be smaller than other parts of the conductive layer 16 / 17. [0004] The trend of electronic products such as mobile phones and PDAs i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 林裕胜吴旭隆
Owner EVERLIGHT ELECTRONICS
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