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Plastic hollow board ultrasonic wave indentation method

A plastic hollow board and ultrasonic technology, which is applied in the field of ultrasonic indentation of plastic hollow boards, can solve the problems of short service life, easy burrs, thin and damaged surface layer, etc., and achieve long service life, thin indentation thickness and rebound force small effect

Inactive Publication Date: 2008-03-19
深圳市亨达洋静电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the process of deep processing of plastic hollow boards, no treatment is done on the edges of the boards. There are holes and grooves on the edges of the boards, which are easy to store dust, easy to burr, not durable, poor in strength, and the workpiece is not easy to pick up without slope.
[0004] When plastic hollow boards are used to make packaging boxes and products that need to be folded, only the traditional crimping method is used at the places that need to be bent or folded. Referring to Figure 1a, the plastic hollow board is indented with a crimping knife when die-cutting. The physical process It is to fold or break the ribs of the plastic hollow board and thin the surface layer so that the hollow board can be bent along this line (see Figure 1c). The disadvantages are: 1), the ribs of the plastic hollow board will bounce back and make the The plastic hollow board has a certain thickness (see Figure 1b), is difficult to bend and has a certain rebound force, the greater the curvature, the greater the rebound force; 2), the surface layer of the plastic hollow board is thin and damaged, and the service life is short; 3 ), 5mm or more thick plates are difficult to process, the yield rate is low, and even cannot be processed

Method used

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  • Plastic hollow board ultrasonic wave indentation method
  • Plastic hollow board ultrasonic wave indentation method
  • Plastic hollow board ultrasonic wave indentation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: thickness 6mm (1600g / m 2 ) The specific indentation process of hollow plate products will position the cut product plate on the ultrasonic equipment platform, using a semi-circular die head,

[0024] 1. Indentation length: 120mm; indentation thickness: 1.4±0.2mm The specific parameters of the ultrasonic equipment are: the distance between the upper and lower dies is 0.8mm; the compressed air pressure is 7kg; welding time: 2.2s; delay time: 0.6s; holding time: 2.5s.

[0025] 2. Indentation length: 100mm; indentation thickness: 1.4±0.2mm The specific parameters of the ultrasonic equipment are: the distance between the upper and lower dies is 0.8mm; the compressed air pressure is 7kg; welding time: 1.9s; delay time: 0.6s; holding time: 2.3s.

[0026] Start the ultrasonic equipment to make traces formed on the plate of the product and the pressing part of the die head.

Embodiment 2

[0027] Embodiment 2: thickness 5mm (1000g / m 2 ) The specific indentation process of the hollow plate product is the same as in Example 1, the selected die head is a semicircular die head, the indentation length is 150mm, and the indentation thickness is 0.6mm; the specific parameters of the ultrasonic equipment are: the distance between the upper and lower dies 0.6mm, compressed air pressure 7kg, welding time: 1.2s, delay time: 0.3s, holding time: 1.6s.

Embodiment 3

[0028] Embodiment 3: thickness 4mm (700g / m 2 ) The specific indentation process of hollow plate products is the same as above, the selected die head is a semicircular die head, the indentation length: 150mm, and the indentation thickness: 0.6mm; the specific parameters of the ultrasonic equipment are: the distance between the upper and lower dies is 0.6mm, Compressed air pressure 7kg, welding time: 1.0s, delay time: 0.3s, holding time: 1.3s.

[0029] Fig. 2a, b, c are schematic diagrams of hollow plates indented by the method of the present invention. A semicircular die is used to indent the hollow plate 1 under pressure. The ribs and surface layer of the plastic hollow plate are fused together under high temperature and high pressure to form the indentation 2 shown in Figure 2a. The thickness of the indentation is 0.2-2.5mm (see Figure 2b), the indentation thickness is thin, easy to bend or fold, can be folded 180 degrees (see Figure 2c), and the rebound force is small. The...

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Abstract

An ultrasonic method far indenting on hollow plastic plate includes dividing the hollow plastic plate to needed sizes, fixing the plate on the platform of ultrasonic apparatus, choosing and installing the ultrasonic indenting heads, regulating their stroke and the delay time, hot pressing time, holding time and pressure of ultrasonic apparatus, and turning on the ultrasonic apparatus for indenting.

Description

technical field [0001] The invention relates to a processing technology of a plastic hollow board, in particular to an ultrasonic indentation method for a plastic hollow board. Background technique [0002] Plastic hollow board is an environmentally friendly plastic board that has only been developed in recent years. As shown in Figure 1, there are reinforcing ribs in the space of the board. It is light in weight, easy to process, and low in cost. It is mainly used for packaging, transshipment and storage of products. . [0003] At present, in the process of deep processing of plastic hollow boards, no treatment is done on the edges of the boards. There are holes and grooves on the edges of the boards, which are easy to store dust, easy to burr, not durable, poor in strength, and the edge has no slope and the workpiece is not easy to take. [0004] When plastic hollow boards are used to make packaging boxes and products that need to be folded, only the traditional crimping ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C53/06
Inventor 刘清松
Owner 深圳市亨达洋静电技术有限公司
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