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Wafer transfer box

A wafer transfer box, cylindrical technology, applied in the field of wafer transfer box with a single rack of wafers, can solve the problems of high cost of intelligent marking device 30, contamination of wafers, fragile particles, etc.

Active Publication Date: 2008-06-11
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In a 12-inch fab, such as figure 1 As shown, the wafer is placed in a wafer transfer box (frontopening unified pod, FOUP) 100, and is handled by an automated material handling system (automated material handling system, AMHS). A radio frequency tag (RFtag) 20 is set on the FOUP 100 for the AMHS to read the relevant information of the FOUP 100. In addition, a smart tag device (smart tag) 30 will be set on the FOUP 100. The smart tag device is provided with a liquid crystal display screen. screen 32, which can display the relevant information of the FOUP 100 (such as the identification number of the FOUP, and the cleaning date of the FOUP) for the operator to read, but the cost of the smart label device 30 is quite high, which will increase the cost of the equipment
In addition, a placement groove 34 is provided on the FOUP 100 for placing a chip message sheet (not shown), but in the known FOUP 100, the placement groove 34 is made of acrylic material, so it is easy to break and produce particles. fear of contaminating the wafer

Method used

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Examples

Experimental program
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Embodiment Construction

[0018] figure 2 It is a sectional view of a preferred embodiment of the FOUP of the present invention. The FOUP 200 includes a body 10 , a rack 50 and a locking member 60 . A wafer (not shown) is disposed in the placement space 5 in the main body 10 . image 3 It is a perspective view of the FOUP main body 10 . The main body 10 is provided with a protrusion 12 on the top, and a recessed portion 16 is formed in the center of the front, and a protrusion 17 is disposed in the recessed portion 16 , and the protrusion 17 corresponds to the hollow portion 63 of the locking member 60 . The rack 50 is disposed on the body 10 , and the locking member 60 is disposed between the body 10 and the rack 50 and combines the body and the rack 50 .

[0019] Figure 4 It is a perspective view of the combination of the rack 50 and the locking member 60 . Figure 5 It is the front view of the rack 50. The rack 50 includes an engaging portion 52 , a supporting plate 54 , a clamping slot 56 ,...

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PUM

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Abstract

The invention relates to a crystal transmission box, which comprises a main body, a support and a locking element, wherein the support is on the main body; the locking element is arranged between main body and support, to fix the support on the main body and form one object space between support and main body; the front face of support has one clamp groove and one inlet, while the clamp groove is used to arrange chip message; and the automatic process list via inlet is thrown into and held in the object space.

Description

technical field [0001] The present invention relates to a wafer transfer box, in particular to a wafer transfer box with simple structure and low cost wafer message single rack. Background technique [0002] In an 8-inch fab, a wafer handling box (pod) is used to move the wafers. Due to its light weight (about 5 or 6 kg), it can be carried by manual handling. In a 12-inch fab, such as figure 1 As shown, the wafer is placed in a wafer transfer box (frontopening unified pod, FOUP) 100, and is handled by an automated material handling system (automated material handling system, AMHS). A radio frequency tag (RFtag) 20 is set on the FOUP 100 for the AMHS to read the relevant information of the FOUP 100. In addition, a smart tag device (smart tag) 30 will be set on the FOUP 100. The smart tag device is provided with a liquid crystal display screen. The screen 32 can display the relevant information of the FOUP 100 (such as the identification number of the FOUP and the cleaning d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673B65D85/00
CPCH01L21/67386H01L21/67373H01L21/67294
Inventor 林佳珍
Owner TAIWAN SEMICON MFG CO LTD